Intel S1155 Instrukcja Użytkownika Pobierz pdf (Strona 85)

Thermal/Mechanical Specifications and Design Guidelines 85

Active Tower Thermal Solution

Note: Diagram does not show the attached hardware for the clip design and is provided only as a mechanical

representation.

10.2.2 Retention Mechanism and Heatsink Attach Clip Assembly

The thermal solution requires a heatsink attach clip assembly, to secure the processor

and fan heatsink in the baseboard socket.

10.3 Electrical Requirements

10.3.1 Active Tower Heatsink Power Supply

The active tower heatsink requires a +12 V power supply. A fan power cable will be

with solution to draw power from a power header on the baseboard. The power cable

connector and pinout are shown in Figure 10-4. Baseboards must provide a matched

power header to support this. Table 10-1 contains specifications for the input and

output signals at the heatsink connector.

The active tower heatsink outputs a SENSE signal, which is an open- collector output

that pulses at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor

provides VOH to match the system board-mounted fan speed monitor requirements, if

applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of

the connector should be tied to GND.

The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the

connector labeled as CONTROL.

The active tower heatsink requires a constant +12 V supplied to pin 2 and does not

support variable voltage control or 3-pin PWM control.

Figure 10-3. Physical Space Requirements for the Solution (top view)

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Intel S1155 Instrukcja Użytkownika Strona 85