Intel S1155 Instrukcja Użytkownika Strona 40

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LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
40 Thermal/Mechanical Specifications and Design Guidelines
A detailed description of this methodology can be found at: ftp://download.intel.com/
technology/itj/q32000/pdf/reliability.pdf.
§
Figure 5-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the
market/expected use
environment for the
technology
Develop Speculative
stress conditions based on
historical data, content
experts, and literature
search
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors
Freeze stressing
requirements and perform
additional data turns
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