Intel S1155 Instrukcja Użytkownika Pobierz pdf (Strona 13)

Thermal/Mechanical Specifications and Design Guidelines 13

Package Mechanical & Storage Specifications

2 Package Mechanical & Storage

Specifications

2.1 Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with

the motherboard via the LGA1155 socket. The package consists of a processor

mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to

the package substrate and core and serves as the mating surface for processor thermal

solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package

components and how they are assembled together. Refer to Chapter 3 and Chapter 4

for complete details on the LGA1155 socket.

The package components shown in Figure 2-1 include the following:

1. Integrated Heat Spreader (IHS)

2. Thermal Interface Material (TIM)

3. Processor core (die)

4. Package substrate

5. Capacitors

Note:

1. Socket and motherboard are included for reference and are not part of processor package.

2. For clarity the ILM not shown.

Figure 2-1. Processor Package Assembly Sketch

IHS

Substrate

System Board

Capacitors

Core (die)

TIM

LGA1155 Socket

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Intel S1155 Instrukcja Użytkownika Strona 13