Intel S1155 Instrukcja Użytkownika Pobierz pdf (Strona 34)

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Independent Loading Mechanism (ILM)

34 Thermal/Mechanical Specifications and Design Guidelines

As indicated in Figure 4-6, the pick and place cover should remain installed during ILM

assembly to the motherboard. After assembly, the pick and place cover is removed,

and the ILM mechanism (with the ILM cover installed) closed to protect the contacts.

The ILM Cover is designed to pop off if the pick and place cover is accidentally left in

place and the ILM closed with the ILM Cover installed. This is shown in Figure 4-7.

Figure 4-6. ILM Cover

Step 3: Close ILM

Step 1: PnP Cover installed

during ILM assembly

Step 2: Remove PnP Cover

1 2 ... 29 30 31 32 33 34 35 36 37 38 39 ... 123 124

Legal Lines and Disclaime rs 2
Contents 3
Revision History 8
1 Introduction 9
1.1 References 10
1.2 Definition of Terms 10
Introduction 12
Specifications 13
37.5 14
2.1.7 Processor Materials 16
2.1.8 Processor Markings 16
Table 2-4. Storage Conditions 18
3 LGA1155 Socket 19
3.1 Board Layout 20
122.6 mil (3.1144mm) 21
36mil (0.9144 mm) 21
3.2 Attachment to Motherboard 22
3.3 Socket Components 23
3.5 Durability 25
3.6 Markings 25
3.8 Socket Size 26
4 Independent Loading 27
Shoulder 30
6-32 thread 30
Figure 4-4. ILM Assembly 31
Load plate not 32
4.5 ILM Cover 33
Step 3: Close ILM 34
Step 1: PnP Cover installed 34
Step 2: Remove PnP Cover 34
5 LGA1155 Socket and ILM 37
5.3 Loading Specifications 38
5.4 Electrical Requirements 38
6 Thermal Specifications 41
6.1.1 Intel 43
6.1.2 Intel 44
Processor E3-1200 45
6.1.3 Intel 46
6.1.4 Intel 47
6.1.5 Intel 48
Graphics Thermal Profile 48
Thermal Sensor Exceeds T 49
6.1.7 Thermal Metrology 54
6.2.1 Processor Temperature 54
6.2.2.1 Frequency/VID Control 55
6.2.2.2 Clock Modulation 56
6.2.2.5 PROCHOT# Signal 57
6.3 Intel 58
Turbo Boost Technology 58
6.4 Thermal Considerations 59
6.4.1 Intel 60
Reporting 60
System Thermal Response Time 61
Turbo Algorithm Response Time 61
Thermal Specifications 62
7 PECI Interface 63
PECI Interface 64
8 Sensor Based Thermal 65
8.2.1 TTV Thermal Profile 67
= (TTV T 69
) / Power 69
8.5 System Validation 73
9 1U Thermal Solution 75
1U Thermal Solution 76
CASE_MAX 77
9.2.2 Thermal Solution 78
9.2.3 Assembly 79
9.3 1U Reference Heatsink 80
9.3.3 Assembly 81
Die Centerline 82
Package Centerline 82
Active Tower Thermal Solution 83
10.3 Electrical Requirements 85
10.4 Cooling Requirements 87
Thermal Solution Quality and 89
Reliability Requirements 89
A Component Suppliers 93
B Mechanical Drawings 95
TOP SIDE 98
BOTTOM SIDE 98
DETAIL A 99
Mechanical Drawings 100
C Socket Mechanical Drawings 115
Socket Mechanical Drawings 116
D Package Mechanical 121
Drawings 121
Package Mechanical Drawings 122

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