Intel S1155 Instrukcja Użytkownika Pobierz pdf (Strona 20)

LGA1155 Socket

20 Thermal/Mechanical Specifications and Design Guidelines

3.1 Board Layout

The land pattern for the LGA1155 socket is 36 mils X 36 mils (X by Y) within each of the

two L-shaped sections. Note that there is no round-off (conversion) error between

socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The

two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm

(122.6 mil) in the y direction, see Figure 3-3. This was to achieve a common package

land to PCB land offset which ensures a single PCB layout for socket designs from the

multiple vendors.

Figure 3-2. LGA1155 Socket Contact Numbering (Top View of Socket)

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

1 2 ... 15 16 17 18 19 20 21 22 23 24 25 ... 123 124

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Intel S1155 Instrukcja Użytkownika Strona 20