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Reference Thermal Solution

22 Intel

955X Express Chipset Thermal/Mechanical Design Guide

Figure 6-5. Plastic Wave Soldering Heatsink Assembly

6.5.1 Heatsink Orientation

To enhance the efficiency of the reference thermal solution, it is important for the designer to

orient the fins properly with respect to the mean airflow direction. Simulation and experimental

evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are

aligned with the mean airflow direction (see Figure 6-3).

6.5.2 Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the MCH. Figure 6-5 shows

the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with

similar dimensions and increased thermal performance may be available. Full mechanical drawing

of this heatsink is provided in Appendix B.

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Intel 955X Instrukcja Użytkownika Strona 22