Intel 955X Instrukcja Użytkownika Pobierz pdf (Strona 20)

Reference Thermal Solution

20 Intel

955X Express Chipset Thermal/Mechanical Design Guide

6.4 Board-Level Components Keep-out Dimensions

The location of hole patterns and keep-out zones for the reference thermal solution are shown in

Figure 6-3 and Figure 6-4.

Figure 6-3. MCH Heatsink Board Component Keep-out

TN B

Heatsink Fin

26.79 mm

48.0 mm

60.6 mm

47.0 mm

135

45.79 mm

67.0 mm

81.0 mm

60.92 mm

Max 2.2 mm

Component

Height

component

this Area

Air Flow

HS_Brd_Component_Keepout

1 2 ... 15 16 17 18 19 20 21 22 23 24 25 ... 35 36

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Intel 955X Instrukcja Użytkownika Strona 20