Intel 955X Instrukcja Użytkownika Pobierz pdf (Strona 18)

Reference Thermal Solution

18 Intel

955X Express Chipset Thermal/Mechanical Design Guide

Figure 6-1. Reference Heatsink Measured Thermal Performance versus Approach Velocity

6.3 Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation

requirements, the height, width, and depth constraints typically placed on the MCH thermal

solution are shown in Figure 6-2.

When using heatsinks that extend beyond the MCH reference heatsink envelope shown in

Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot

exceed 2.2 mm (0.087 in.) in height.

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Intel 955X Instrukcja Użytkownika Strona 18