Intel 955X Instrukcja Użytkownika Pobierz pdf (Strona 16)

Thermal Metrology

16 Intel

955X Express Chipset Thermal/Mechanical Design Guide

Figure 5-1. Thermal Solution Decision Flowchart

Therm_Solution_Flow

Attach

thermocouples using

recommended

metrology. Setup the

system in the desired

configuration.

Tdie >

Specification?

Heatsink

Required

Select Heatsink

End

Start

Run the Power

program and

monitor the

device die

temperature.

Attach device

to board using

normal reflow

process.

Yes

Figure 5-2. Zero Degree Angle Attach Methodology

Figure 5-3. Zero Degree Angle Attach Methodology (Top View)

0_Angle_Attach_Method

Cement +

Thermocouple Bead

Die

Thermocouple

Wire

Substrate

NOTE: Not to scale.

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Intel 955X Instrukcja Użytkownika Strona 16