Intel CHIPSET 820E Instrukcja Użytkownika Strona 106
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Intel
®
820E Chipset
R
106 Design Guide
Figure 67. LAN_CLK Routing Example
LAN_RXD0 LAN_CLK
2.22.1.5. Crosstalk Consideration
Crosstalk-induced noise must be carefully minimized. Crosstalk is the principal cause of timing skews
and is the largest part of the t
RMATCH skew parameter.
2.22.1.6. Impedances
Motherboard impedances should be controlled to minimize the effect of any mismatch between the
motherboard and an add-in card. An impedance of 60 Ω ± 15% is strongly recommended. Otherwise, the
signal integrity requirements may be violated.
2.22.1.7. Line Termination
Line termination mechanisms are not specified for the LAN connect interface. Slew rate-controlled
output buffers provide acceptable signal integrity by controlling signal reflection, overshoot/undershoot,
and ringback. A 33-Ω series resistor can be installed at the driver side of the interface, if the developer
has concerns about overshoot/undershoot. Note that the receiver must allow for any drive strength and
board impedance characteristic within the specified ranges.
- 820E Chipset 1
- Contents 3
- Figures 8
- Revision History 12
- 1. Introduction 13
- 1.2. Reference Documents 14
- 1.3. System Overview 15
- 1.3.1. Chipset Components 16
- 1.3.2. Bandwidth Summary 17
- 1.3.3. System Configuration 18
- 1.4. Platform Initiatives 20
- 1.4.7. Expanded USB Support 21
- 1.4.8. Manageability 21
- 1.4.9. AC’97 23
- AC97_conn 24
- 2. Layout/Routing Guidelines 27
- (324-Ball 28
- 2.3. Intel 29
- Data Associated Strobe 33
- SBA[7:0] SB_STB 33
- 2.7.1. Stack-Up 34
- 2.7.2.1. RSL Routing 35
- 2.7.2.2. RSL Termination 38
- Required 40
- Length × Width = Area = C 41
- × Thickness of prepreg / [(ε 41
- ) (1.1)] 41
- Recommendation 47
- 2.7.2.7. Via Compensation 52
- 1,2,3,4,5,6,7,8,9,10 53
- RSL Signals High-Speed 57
- CMOS Signals 57
- CMOS Signal 57
- If Signal Routed from MCH 59
- 2.8. AGP 2.0 60
- Signal Groups 61
- Strobe in 2× 62
- Associated Strobes 62
- AGP_2x-4x_routing 63
- All AGP Interfaces 64
- 2.8.5. AGP Clock Routing 65
- 2.8.7. V 66
- Generation and TYPEDET# 66
- TYPEDET# (on Add-in Card) V 67
- (Supplied by MB) 67
- 2.8.8. V 68
- 1.5-V AGP Card 69
- 3.3-V AGP Card 69
- 2.8.9. Compensation 70
- 2.8.10. AGP Pull-Ups 70
- 1× 2× 4× 71
- (Preferred) 73
- “Right-Handed” Orientation 73
- (Alternate) 73
- 2.9. Hub Interface 74
- III Processor for the 77
- GND Plane 78
- 2.12. IDE Interface 79
- IDE_combo_cable_det 81
- IDE_dev_cable_det 82
- 2.13. AC’97 85
- CNR BoardMotherboard 87
- CNR Connector 87
- Valid Codec Configurations 90
- 2.13.3. AC’97 Routing 91
- 2.14. USB 92
- 2.15. ISA Support 93
- 2.17. SMBus/SMLink Interface 94
- Ω pull-up resistors to 3.3 V 95
- 2.18. PCI 96
- 2.19. RTC 96
- = (C2 × C3) / (C2 + C3) + C 97
- VCC3_3SBY 98
- 2.21. ICH2 PIRQ Routing 101
- 2.22. LAN Layout Guidelines 102
- Layout Section Previous 103
- Reference 103
- Design Guide Section 103
- 2.22.1.1. Bus Topologies 104
- Configuration A B C D 105
- 2.22.1.6. Impedances 106
- 2.22.1.7. Line Termination 106
- LAN_RXD0 LAN_CLK 106
- 2.22.2.1.2. Signal Isolation 108
- Top-Layer Routing 110
- Ground Plane 110
- Power Plane 110
- Bottom Layer Routing 110
- 82555 or Intel 111
- 2.22.3. Intel 112
- Distance Priority Guideline 114
- 2.22.4. Intel 115
- 82562ET / Intel 115
- MMBT3906 119
- 2.22.6. Intel 120
- 82562ET and Intel 120
- 82562EH Components’ Dual 120
- Footprint Guidelines 120
- Capacitors 122
- Capacitor Value 122
- Design Guide 123 123
- 2.24. ICH2 Design Checklist 125
- Ω ± 3 kΩ 129
- 2.25. ICH2 Layout Checklist 134
- Design Guide 135 135
- Table 46. LAN Connect I/F 135
- ≤ 0.25 inch max 137
- 138 Design Guide 138
- Term Definition 139
- Guideline Methodology 141
- 3.2.3. Pre-Layout Simulation 145
- 3.2.3.4. Simulation Criteria 146
- 3.2.4.3. Host Clock Routing 148
- 3.2.6. Validation 150
- Valid delay = T 151
- 3.3. Theory 152
- 3.3.3. Crosstalk Theory 153
- Decoupling 156
- Signal Layer A 157
- Signal Layer B 157
- 3.4.4. Clock Routing 160
- 3.5.1. V 161
- Guard Band 161
- 3.5.2. Ringback Levels 161
- 3.5.3. Overdrive Region 161
- 3.6. Conclusion 162
- 4. Clocking 163
- 820_clk_route 166
- NOTES: 167
- Requirements 168
- CPU_div2 168
- 4.2.3. MCH to DRCG 169
- 4.2.4. DRCG-to-RDRAM Channel 170
- 4.2.5. Trace Length 170
- Ground CLOCK/CLOCK# Ground 171
- PGA370 Designs 173
- 4.7. Unused Outputs 174
- Design Guide 175 175
- 5. System Manufacturing 177
- 5.1.2. Design Process 178
- 5.1.4. Recommended Stack-Up 179
- 5.1.5. Inner-Layer Routing 179
- #1 #2 #3 #4 #5 #6 180
- Not Routable 181
- 182 Design Guide 182
- 6.1. Power Delivery 183
- 5 V Dual Switch 185
- VCCVID 185
- VCC 2.5 185
- 2.5 VBSY 186
- 1.8 VSB 188
- Design Guide 191 191
- 6.2. ICH2 Power Plane Split 192
- 6.3. Thermal Design Power 193
- 6.4. Glue Chip 3 (Intel 193
- 820E Chipset Glue Chip) 193
- Appendix A: Reference Design 195
- Schematics (Uniprocessor) 195
- 196 Design Guide 196
- REVISION 0.5 197
- INTEL(R) 820E CHIPSET 197
- Block Diagram 198
- Device Table 198
- 370-PIN SOCKET 199
- Clock Synthesizer 201
- MMBT3904LT1 203
- Top Block Lock 206
- RIMM Sockets 207
- Super I/O 208
- AC’97 Audio 209
- EEPROMLAN 211
- CNR OR LAN DOWN 212
- Stuffing Option for 212
- LAN (82562EH) 213
- LAN (82562ET/EM) 214
- LAN (RJ11 For 82562EH) 215
- LAN (RJ45 For 82562ET/EM) 216
- STUFF FOR 82562EH ONLY 217
- STUFF FOR 82562EH 218
- STUFF FOR GILAD ONLY 218
- AGP Connector 220
- PCI Connectors 221
- IDE Connectors 223
- USB Connectors 224
- Parallel Port 225
- Serial Ports 226
- Keyboard/Mouse/Floppy 227
- Game Port 228
- Voltage Regulators 230
- Power Connector 232
- AGTL Termination 233
- PCI/AGP Pullups/Pulldowns 234
- Rambus* Termination 235
- Un-used Gates 236
- Hub Interface Connector 239
- For debug only 239
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