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Datasheet, Volume 1 43
Power Management
4 Power Management
This chapter provides information on the following power management topics:
• Advanced Configuration and Power Interface (ACPI) States
• Processor Core
• Integrated Memory Controller (IMC)
• PCI Express*
• Direct Media Interface (DMI)
• Processor Graphics Controller
Figure 4-1. Power States
- Datasheet, Volume 1 1
- 2 Datasheet, Volume 1 2
- Contents 3
- 4 Datasheet, Volume 1 4
- Datasheet, Volume 1 5 5
- 6 Datasheet, Volume 1 6
- Datasheet, Volume 1 7 7
- 8 Datasheet, Volume 1 8
- Revision History 9
- 10 Datasheet, Volume 1 10
- 1 Introduction 11
- Introduction 12
- 1.1 Processor Feature Details 13
- 1.2 Interfaces 13
- 1.2.2 PCI Express* 14
- Datasheet, Volume 1 15 15
- 1.2.5 Processor Graphics 16
- 1.3 Power Management Support 17
- 1.5 Package 18
- 1.6 Terminology 18
- 1.7 Related Documents 20
- 2 Interfaces 21
- 2.1.3.1 Single-Channel Mode 22
- Flex Memory Technology Mode 22
- Datasheet, Volume 1 23 23
- Interfaces 23
- 2.1.5.2 Command Overlap 24
- 2.2 PCI Express* Interface 25
- 2.2.1.1 Transaction Layer 26
- 2.2.1.2 Data Link Layer 26
- 2.2.1.3 Physical Layer 26
- 2.2.3 PCI Express Graphics 27
- 2.3.1 DMI Error Flow 28
- 2.3.3 DMI Link Down 29
- 2.4.1.2 3D Pipeline 30
- 2.4.1.3 Video Engine 31
- 2.4.1.4 2D Engine 31
- 2.4.2.1 Display Planes 32
- 2.4.3 Intel 33
- 2.6 Interface Clocking 34
- 3 Technologies 35
- Technologies 36
- Datasheet, Volume 1 37 37
- 3.4 Intel 39
- Turbo Boost Technology 39
- 3.4.2 Intel 40
- 3.7 Intel 41
- 64 Architecture x2APIC 41
- 4 Power Management 43
- (ACPI) States Supported 44
- 4.2.1 Enhanced Intel 46
- SpeedStep 46
- Technology 46
- 4.2.2 Low-Power Idle States 47
- Power Management 48
- 4.2.4 Core C-states 49
- 4.2.5 Package C-States 50
- 4.2.5.1 Package C0 51
- 4.2.5.2 Package C1/C1E 52
- 4.2.5.3 Package C3 State 52
- 4.2.5.4 Package C6 State 52
- Management 53
- Datasheet, Volume 1 55 55
- 4.6 Graphics Power Management 57
- 4.7 Thermal Power Management 59
- 5 Thermal Management 61
- 5.2.1 Intel 62
- Reporting 62
- 5.2.2 Package Power Control 63
- 5.2.3 Power Plane Control 63
- 5.2.4 Turbo Time Parameter 63
- Thermal Management 64
- Datasheet, Volume 1 69 69
- 5.4.1.3 PROCHOT# Signal 71
- 5.4.2.1 On-Demand Mode 73
- 6 Signal Description 75
- Signal Description 76
- Table 6-8. Intel 80
- 6.11 Power Sequencing Signals 82
- 6.12 Processor Power Signals 82
- 6.13 Sense Signals 83
- 7 Electrical Specifications 85
- 7.4 System Agent (SA) V 90
- 7.6 Signal Groups 91
- Table 7-3. Signal Groups 92
- (Sheet 2 of 3) 92
- 7.9 DC Specifications 94
- Table 7-5. Processor Core (V 95
- ±200 mV and the 99
- Electrical Specifications 100
- DC Specifications 101
- Datasheet, Volume 1 103 103
- 8 Processor Pin and Signal 105
- 106 Datasheet, Volume 1 106
- Datasheet, Volume 1 107 107
- 108 Datasheet, Volume 1 108
- Datasheet, Volume 1 109 109
- List by Pin Name 110
- Datasheet, Volume 1 121 121
- 122 Datasheet, Volume 1 122
- Datasheet, Volume 1 123 123
- 124 Datasheet, Volume 1 124
- List by Ball Name 125
- 140 Datasheet, Volume 1 140
- Datasheet, Volume 1 141 141
- 142 Datasheet, Volume 1 142
- Datasheet, Volume 1 143 143
- Datasheet, Volume 1 155 155
- 156 Datasheet, Volume 1 156
- Datasheet, Volume 1 157 157
- 158 Datasheet, Volume 1 158
- Datasheet, Volume 1 159 159
- 160 Datasheet, Volume 1 160
- Datasheet, Volume 1 161 161
- 162 Datasheet, Volume 1 162
- Datasheet, Volume 1 163 163
- 164 Datasheet, Volume 1 164
- Datasheet, Volume 1 165 165
- 166 Datasheet, Volume 1 166
- 9 DDR Data Swizzling 167
- Table – Channel A 168
- Table – Channel B 169
- DDR Data Swizzling 170
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