Intel 815 Instrukcja Użytkownika Strona 109
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Oceniono. / 5. Na podstawie oceny klientów
Hub Interface
R
Intel
®
815 Chipset Platform Design Guide 109
Figure 54. Single-Hub-Interface Reference Divider Circuit
HUBREF
HUBREF
GMCH
ICH
hub_IF_ref_div_1
300
Ω
1.85 V
300
Ω
0.01 µF
0.01 µF
0.1 µF
Figure 55. Locally Generated Hub Interface Reference Dividers
HUBREF
HUBREF
GMCH
ICH
hub_IF_ref_div_2
300
Ω
1.85 V
300
Ω
0.01 µF
300
Ω
1.85 V
300
Ω
0.01 µF
9.1.4 Compensation
Independent hub interface compensation resistors are used by the GMCH and ICH to adjust buffer
characteristics to specific board characteristics. Refer to the Intel
®
815 Chipset Family: 82815
Graphics and Memory Controller Hub (GMCH) for use with the Universal Socket 370 Datasheet
and the Intel
®
82801AA (ICH) and 82801AB (ICH0) I/O Controller Hub Datasheet for details on
compensation. The resistive compensation (RCOMP) guidelines are as follows:
• RCOMP: Tie the HLCOMP pin of each component to a 40 Ω 1% or 2% pull-up resistor (to
1.85V) via a 10-mil-wide, 0.5 inch trace (targeted at a nominal trace impedance of 40 Ω). The
GMCH and ICH each requires their own RCOMP resistor.
- 815 Chipset Platform 1
- Contents 3
- Figures 8
- Revision History 11
- 1 Introduction 13
- 1.1 Terminology 14
- Term Description 15
- 1.2 Reference Documents 16
- 1.3 System Overview 16
- 1.3.1 System Features 17
- 1.3.2 Component Features 18
- 1.3.2.2 Intel 20
- 1.3.2.3 Firmware Hub (FWH) 20
- 1.3.3 Platform Initiatives 21
- TCO Timer 22
- Processor Present Indicator 22
- Function Disable 22
- Intruder Detect 22
- Alert on LAN* 22
- 1.3.3.7 AC’97 23
- 2.1 Nominal Board Stackup 25
- Future 0.13 Micron 31
- Socket 370 31
- Processors 31
- Proc_Detect 32
- Selection Switch 33
- 4.2.4 VTT Processor Pin AG1 34
- SMAA[12] 35
- Proc_ID_Strap 35
- VTTPWRGD_Config 36
- 4.2.7 VCMOS Reference 37
- PWRGOOD to Processor 38
- PW RGOOD from ICH2 38
- API_CLK_SW 39
- 63.4 Ω 75 Ω 40
- 150 Ω 150 Ω 40
- ProcessorGMCH 40
- VDD on CK-815 41
- VTTPWRGD12 41
- ICH_PWROK_GATING 42
- PGA370 socket 46
- L(1): Z 46
- = 60 Ω ± 15% 46
- Ground Reference 47
- Reference Plane Splits 47
- Processor Connector Breakout 47
- Minimizing Cross-Talk 48
- 5.2.1.2 THRMDP and THRMDN 50
- Designs 51
- for future 0.13 micron 52
- • Reserved for Pentium III 55
- • 1.25V PLL reference 55
- • VCC2.5 for Pentium III 55
- Ω), 1% R2 (Ω) 57
- Ω), 1% CLKREF Voltage (V) 57
- 5.9.1 Topology 59
- 5.9.2 Filter Specification 59
- NOTES: 60
- 1. Diagram not to scale 60
- PLL_filter_1 62
- PLL_filter_2 62
- 5.12 Thermal Considerations 65
- 5.13 Debug Port Changes 67
- 6 System Memory Design 69
- Guidelines 69
- A B C D E F 71
- Signal Top 71
- Min. (16 Mbit) 8 MB 73
- Max. (64 Mbit) 256 MB 73
- Max. (128 Mbit) 512 MB 73
- A B C D E F G 74
- 6.5 Compensation 77
- 7 AGP/Display Cache Design 79
- 7.2 AGP 2.0 82
- AGP_2x-4x_routing 85
- 7.3.4 AGP Clock Routing 88
- AGP_decoupling_cap_placement 89
- AGP_Down_1x-2x 91
- 7.4.4 AGP Clock Routing 92
- AGP_VDDQ_gen_ex_circ 94
- 7.6.1 Compensation 97
- 7.6.2 AGP Pull-Ups 97
- 8.1 Analog RGB/CRT 101
- NOTE: Diodes D 102
- Board Cross Section 103
- Graphics Chip 105
- 8.2 Digital Video Out 106
- 9 Hub Interface 107
- 9.1.1 Data Signals 108
- 9.1.2 Strobe Signals 108
- 9.1.4 Compensation 109
- 10 I/O Subsystem 111
- IDE connector 112
- Black wires: ground 112
- Grey wires: signals 112
- IDE_cable_det_host 114
- IDE_resistor_schem_primar 116
- IDE_resistor_schem_secondar 117
- Detection 118
- 10.3 AC’97 119
- Controller) 123
- 10.6 SMBus 124
- 10.7 PCI 124
- 10.8 LPC/FWH 125
- 10.9 RTC 125
- 10.9.1 RTC Crystal 126
- 10.9.2 External Capacitors 126
- VCC3_3SBY 127
- RTC_RTCRESET_ext_circ 128
- 11 Clocking 131
- 11.2 3-DIMM Clocking 133
- PCI slots 134
- Processor 135
- 136 Intel 136
- Clocking 137
- 11.4 Clock Decoupling 137
- 138 Intel 138
- 11.6 Clock Skew Assumptions 138
- 11.7 Intel 139
- 140 Intel 140
- 12 Power Delivery 141
- 142 Intel 142
- Power Delivery 143
- 144 Intel 144
- 12.1 Thermal Design Power 144
- LEAKAGE 145
- 146 Intel 146
- 148 Intel 148
- 150 Intel 150
- 152 Intel 152
- 154 Intel 154
- 13 System Design Checklist 155
- 156 Intel 156
- /Connect to ICH 156
- System Design Checklist 157
- 158 Intel 158
- 13.3 GMCH Checklist 158
- 160 Intel 160
- 13.4 ICH Checklist 161
- 162 Intel 162
- 164 Intel 164
- 13.5 LPC Checklist 165
- 166 Intel 166
- 13.6 System Checklist 166
- 13.7 FWH Checklist 166
- 168 Intel 168
- 13.9 LAN Checklist 168
- 170 Intel 170
- Memory Vendors 171
- 172 Intel 172
- Board (CRB) 173
- COVER SHEET 174
- BLOCK DIAGRAM 175
- 370PGA SOCKET, PART 1 176
- 370PGA SOCKET, PART 2 177
- Clock Synthesizer 178
- 82815B GMCH, PART 1, 4, AND 5 179
- 82815B GMCH, PART 2 180
- 82815B GMCH, PART 3 181
- AGP CONNECTOR 182
- SYSTEM MEMORY 183
- ICH, PART 1 185
- INTEL 82801AA 185
- PART 1 185
- ICH, PART 2 186
- FIRMWARE HUB (FWH) SOCKET 187
- SUPER I/O 188
- PCI CONNECTOR 0 189
- (DEV Ah) 189
- PCI CONNECTOR 1 190
- (DEV Bh) 190
- IDE CONNECTORS 191
- TUSB2043 192
- PARALLEL PORT 193
- Serial Port and Header 194
- Keyboard/Mouse Port 195
- Floppy Disk Header 195
- Game Port 196
- Digital Video Out Connector 197
- (FOR DEBUG PURPOSES ONLY) 197
- VGA CONNECTOR 198
- Audio/Modem Riser 199
- AC'97 Audio Codec 200
- Audio Connectors 201
- Last Revision Date: 202
- Voltage Regulators 204
- AGP, VCMOS Voltage Regulator 205
- Processor Voltage Regulator 206
- SYSTEM, PART 1 207
- SN74LVC06A has 5V input 208
- Unused Gates 209
- 370-pin Socket Decoupling 210
- VRM DECOUPLING 211
- Hub Interface Connector 212
- THERMTRIP 213
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