Intel E8501 Instrukcja Użytkownika Strona 25
- Strona / 54
- Spis treści
- BOOKMARKI
- E8500/E8501 Chipset North 1
- Bridge (XMB) 1
- Contents 3
- Revision History 6
- 1 Introduction 7
- 1.2 Definition of Terms 8
- 1.3 Reference Documents 9
- Introduction 10
- 2 Packaging Technology 11
- Packaging Technology 12
- 14 Intel 14
- 3 Thermal Specifications 15
- 16 Intel 16
- 4 Thermal Simulation 17
- Thermal Simulation 18
- 5 Thermal Metrology 19
- Thermal Metrology 20
- 5.2 Power Simulation Software 21
- 6.1 Operating Environment 23
- 6.2 Heatsink Performance 23
- 24 Intel 24
- Heatsink 25
- Motherboard 25
- TNB Location 26
- 4X Ø 2.95 ± 0.0254mm 26
- 4X Ø 5.5mm 26
- 6.5.1 Heatsink Orientation 27
- 28 Intel 28
- 6.6 Reliability Guidelines 29
- 30 Intel 30
- 7.1 Operating Environment 31
- 7.2 Heatsink Performance 31
- 32 Intel 32
- 7.5.1 Heatsink Orientation 34
- 7.6 Reliability Guidelines 35
- 36 Intel 36
- 8.1 Operating Environment 37
- 8.2 Heatsink Performance 37
- Heatsink Fin 38
- Heatsink Base 38
- XMB Location 39
- 40 Intel 40
- 8.6 Reliability Guidelines 41
- 42 Intel 42
- A Thermal Solution Component 43
- Suppliers 43
- 44 Intel 44
- Part Intel Part Number 45
- Supplier 45
- (Part Number) 45
- Contact Information 45
- 46 Intel 46
- B Mechanical Drawings 47
- Mechanical Drawings 48
Powiązane produkty i podręczniki dla Nie Intel E8501
(70 strony)
(32 strony)
(1 strony)
(13 strony)
(10 strony)
(26 strony)
(281 strony)
(198 strony)
(84 strony)
(1 strony)
(54 strony)
(53 strony)
(31 strony)
(23 strony)
(60 strony)
© 2020, manymanuals.pl. Wszelkie prawa zastrzeżone. | 0.087 s |
Manymanuals.com
Manymanuals.de
Manymanuals.fr
Manymanuals.it
Manymanuals.pl
Manymanuals.cz
Manymanuals.es
Manymanuals-pt.com
Komentarze do niniejszej Instrukcji