Intel E8501 Instrukcja Użytkownika Strona 1
Przeglądaj online lub pobierz Instrukcja Użytkownika dla Nie Intel E8501. Intel E8501 User's Manual Instrukcja obsługi
- Strona / 54
- Spis treści
- BOOKMARKI
- E8500/E8501 Chipset North 1
- Bridge (XMB) 1
- Contents 3
- Revision History 6
- 1 Introduction 7
- 1.2 Definition of Terms 8
- 1.3 Reference Documents 9
- Introduction 10
- 2 Packaging Technology 11
- Packaging Technology 12
- 14 Intel 14
- 3 Thermal Specifications 15
- 16 Intel 16
- 4 Thermal Simulation 17
- Thermal Simulation 18
- 5 Thermal Metrology 19
- Thermal Metrology 20
- 5.2 Power Simulation Software 21
- 6.1 Operating Environment 23
- 6.2 Heatsink Performance 23
- 24 Intel 24
- Heatsink 25
- Motherboard 25
- TNB Location 26
- 4X Ø 2.95 ± 0.0254mm 26
- 4X Ø 5.5mm 26
- 6.5.1 Heatsink Orientation 27
- 28 Intel 28
- 6.6 Reliability Guidelines 29
- 30 Intel 30
- 7.1 Operating Environment 31
- 7.2 Heatsink Performance 31
- 32 Intel 32
- 7.5.1 Heatsink Orientation 34
- 7.6 Reliability Guidelines 35
- 36 Intel 36
- 8.1 Operating Environment 37
- 8.2 Heatsink Performance 37
- Heatsink Fin 38
- Heatsink Base 38
- XMB Location 39
- 40 Intel 40
- 8.6 Reliability Guidelines 41
- 42 Intel 42
- A Thermal Solution Component 43
- Suppliers 43
- 44 Intel 44
- Part Intel Part Number 45
- Supplier 45
- (Part Number) 45
- Contact Information 45
- 46 Intel 46
- B Mechanical Drawings 47
- Mechanical Drawings 48
Podsumowanie treści
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB)Thermal/Mechanical Design GuideMay 2006Document Number 306749-002
Introduction10 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 11Bridge (XMB) Thermal/Mechanical Design Guide2 Packaging TechnologyThe E8500/E8501 c
Packaging Technology12 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design GuideNOTES:1. All dimens
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 13Bridge (XMB) Thermal/Mechanical Design GuidePackaging TechnologyFigure 2-4. XMB Pac
Packaging Technology14 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide2.1 Package Mechani
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 15Bridge (XMB) Thermal/Mechanical Design Guide3 Thermal Specifications3.1 Thermal Des
Thermal Specifications16 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design GuideNOTE:1. These spe
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 17Bridge (XMB) Thermal/Mechanical Design Guide4 Thermal SimulationIntel provides ther
Thermal Simulation18 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 19Bridge (XMB) Thermal/Mechanical Design Guide5 Thermal MetrologyThe system designer
2 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design GuideINFORMATION IN THIS DOCUMENT IS PROVIDED
Thermal Metrology20 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide001240NOTE: Not to sca
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 21Bridge (XMB) Thermal/Mechanical Design GuideThermal Metrology5.2 Power Simulation S
Thermal Metrology22 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 23Bridge (XMB) Thermal/Mechanical Design Guide6 NB Reference Thermal Solution #1Intel
NB Reference Thermal Solution #124 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide6.3 Mec
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 25Bridge (XMB) Thermal/Mechanical Design GuideNB Reference Thermal Solution #16.4 Boa
NB Reference Thermal Solution #126 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide6.5 Fir
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 27Bridge (XMB) Thermal/Mechanical Design GuideNB Reference Thermal Solution #16.5.1 H
NB Reference Thermal Solution #128 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guidethe the
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 29Bridge (XMB) Thermal/Mechanical Design GuideNB Reference Thermal Solution #16.6 Rel
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 3Bridge (XMB) Thermal/Mechanical Design GuideContents1 Introduction...
NB Reference Thermal Solution #130 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 31Bridge (XMB) Thermal/Mechanical Design Guide7 NB Reference Thermal Solution #2Intel
NB Reference Thermal Solution #232 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide7.3 Mec
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 33Bridge (XMB) Thermal/Mechanical Design GuideNB Reference Thermal Solution #27.4 Boa
NB Reference Thermal Solution #234 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide7.5.1 H
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 35Bridge (XMB) Thermal/Mechanical Design GuideNB Reference Thermal Solution #27.6 Rel
NB Reference Thermal Solution #236 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide
Intel® E8500 /E8501 Chipset North Bridge (NB) and eXternal Memory 37Bridge (XMB) Thermal/Mechanical Design Guide8 XMB Reference Thermal SolutionIntel
XMB Reference Thermal Solution38 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide8.3 Mecha
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 39Bridge (XMB) Thermal/Mechanical Design GuideXMB Reference Thermal SolutionFull mech
4 Intel® E8500/8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide8.5 XMB Heatsink Thermal Solution Assembl
XMB Reference Thermal Solution40 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide8.5.2 Ext
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 41Bridge (XMB) Thermal/Mechanical Design GuideXMB Reference Thermal Solution8.6 Relia
XMB Reference Thermal Solution42 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 43Bridge (XMB) Thermal/Mechanical Design GuideA Thermal Solution Component SuppliersT
Thermal Solution Component Suppliers44 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design GuideTab
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 45Bridge (XMB) Thermal/Mechanical Design GuideThermal Solution Component SuppliersNOT
Thermal Solution Component Suppliers46 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 47Bridge (XMB) Thermal/Mechanical Design GuideB Mechanical DrawingsTable B-1. Mechani
Mechanical Drawings48 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design GuideFigure B-1. NB Heat
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 49Bridge (XMB) Thermal/Mechanical Design GuideMechanical DrawingsFigure B-2. NB Heat
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 5Bridge (XMB) Thermal/Mechanical Design GuideTables3-1 Intel® E8500 Chipset NB Therma
Mechanical Drawings50 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design GuideFigure B-3. NB Heat
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 51Bridge (XMB) Thermal/Mechanical Design GuideMechanical DrawingsFigure B-4. NB Heat
Mechanical Drawings52 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design GuideFigure B-5. XMB Hea
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 53Bridge (XMB) Thermal/Mechanical Design GuideMechanical DrawingsFigure B-6. XMB Hea
Mechanical Drawings54 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide§
6 Intel® E8500/8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design GuideRevision History§Document NumberRevision
Intel® E8500 /E8501Chipset North Bridge (NB) and eXternal Memory 7Bridge (XMB) Thermal/Mechanical Design Guide1 IntroductionAs the complexity of compu
Introduction8 Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal MemoryBridge (XMB) Thermal/Mechanical Design Guide0012391.2 Definition of Term
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 9Bridge (XMB) Thermal/Mechanical Design GuideIntroductionXMB Intel® E8500/E8501 chips
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