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Case Temperature Reference Metrology

96 Thermal and Mechanical Design Guidelines

Figure 7-24. Applying Flux to the Thermocouple Bead

15. Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using

tweezers to hold the solder while cutting with a fine blade (Figure

7-25).

Figure

7-25. Cutting Solder

16. Place the two pieces of solder in parallel, directly over the thermocouple bead

(Figure

7-26).

1 2 ... 91 92 93 94 95 96 97 98 99 100 101 ... 127 128

Contents 3
Figures 6
Revision History 9
1 Introduction 11
1.1.3 Document Scope 12
1.2 References 13
1.3 Definition of Terms 13
 measurements 14
Information 15
2.1.2 Heatsink Attach 17
2.2 Thermal Requirements 18
2.2.2 Thermal Profile 19
2.2.4 T 20
7, Intel 21
2.3.4 and 21
2.3.1 Heatsink Size 22
2.3.2 Heatsink Mass 22
2.3.3 Package IHS Flatness 23
2.4.3 Summary 25
3 Thermal Metrology 27
3.1.1 Example 28
Assessment 29
Guidelines 29
3-3. The 30
Thermal Metrology 31
Thermal Monitor Feature 33
4.2.1 PROCHOT# Signal 34
4.2.3 Thermal Monitor 2 35
4.2.5 On-Demand Mode 37
4.2.6 System Considerations 37
Considerations 38
4.2.8 THERMTRIP# Signal 38
7 and the Intel 40
(BTX) Thermal/Mechanical 41
Design Information 41
5.1.2 Acoustics 42
5.1.3 Effective Fan Curve 43
Airflow (cfm) 44
5.1.5 Altitude 45
5-2. Random Vibration PSD 46
5.2.2 Power Cycling 47
5.4 Safety Requirements 49
Thermal Module Assembly 49
Detail A 52
Detail B 52
6 ATX Thermal/Mechanical 53
Appendix H 54
6.2.1 Heatsink Performance 55
6.2.2 Acoustics 56
6.2.3 Altitude 56
3.3 and 6.6) 57
6-3. Random Vibration PSD 58
6.3.2 Power Cycling 59
6.5 Safety Requirements 61
Thermal Mechanical Design 61
Less curvature in 62
Shock Load 62
Core shoulder 63
7 Intel 65
Quiet System 65
Technology (Intel 65
7-1. Intel 66
RPM Temperature 67
7-3 and listed below: 68
7-3. Intel 68
7.3 Intel 70
A.3.1, and A.3.2 76
Metrology 77
B.1 Overview 77
B.2 Test Preparation 77
Heatsink Clip Load Metrology 78
Load Cells (3x) 79
Preload Fixture (copper 79
B.3 Test Procedure Examples 80
Measurement 81
Appendix C Thermal Interface 83
Management 83
C.1 Bond Line Management 83
C.2 Interface Material Area 83
Thermal Interface Management 84
Appendix D Case Temperature 85
Reference Metrology 85
D.1 Objective and Scope 85
7-11. Order 86
7-11. Omega Thermocouple 86
D.4 IHS Groove 87
7-14 for the 775-Land 90
D.2 and D.3 91
7-16) 91
7-17) 91
7-19-A and B) 92
TC Wire with Insulation 94
IHS with Groove 94
7-24) 95
7-25) 96
7-25. Cutting Solder 96
7-26) 96
D.5.3 Solder Process 97
7-27. Solder Station Setup 98
7-28 and Figure 7-29) 98
Installation 100
7-32) 101
7-33) 101
7-34) 102
7-36) 103
Extended (BTX) System 105
Thermal Considerations 105
Thermal 107
MCH Heatsink 107
Reference Design 109
BOARD PRIMARY SIDE 112
BOARD SECONDARY SIDE 113
Mechanical Drawings 114
Figure 7-54. Intel 126
Appendix H Intel 127
Enabled Reference 127
Solution Information 127

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