Intel BX80570E8200A Arkusz Danych Pobierz pdf (Strona 93)

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Case Temperature Reference Metrology

Thermal and Mechanical Design Guidelines 93

Figure 7-19. Thermocouple Bead Placement

(A)

(B)

10. Place the package under the microscope to continue with process. It is also

recommended to use a fixture (like processor tray or a plate) to help holding the

unit in place for the rest of the attach process.

11. While still at the microscope, press the wire down about 6mm [0.125”] from the

thermocouple bead using the tweezers or your finger. Place a piece of Kapton*

tape to hold the wire inside the groove (Figure

7-20). Refer to Figure 7-21 for

detailed bead placement.

1 2 ... 88 89 90 91 92 93 94 95 96 97 98 ... 127 128

Contents 3
Figures 6
Revision History 9
1 Introduction 11
1.1.3 Document Scope 12
1.2 References 13
1.3 Definition of Terms 13
 measurements 14
Information 15
2.1.2 Heatsink Attach 17
2.2 Thermal Requirements 18
2.2.2 Thermal Profile 19
2.2.4 T 20
7, Intel 21
2.3.4 and 21
2.3.1 Heatsink Size 22
2.3.2 Heatsink Mass 22
2.3.3 Package IHS Flatness 23
2.4.3 Summary 25
3 Thermal Metrology 27
3.1.1 Example 28
Assessment 29
Guidelines 29
3-3. The 30
Thermal Metrology 31
Thermal Monitor Feature 33
4.2.1 PROCHOT# Signal 34
4.2.3 Thermal Monitor 2 35
4.2.5 On-Demand Mode 37
4.2.6 System Considerations 37
Considerations 38
4.2.8 THERMTRIP# Signal 38
7 and the Intel 40
(BTX) Thermal/Mechanical 41
Design Information 41
5.1.2 Acoustics 42
5.1.3 Effective Fan Curve 43
Airflow (cfm) 44
5.1.5 Altitude 45
5-2. Random Vibration PSD 46
5.2.2 Power Cycling 47
5.4 Safety Requirements 49
Thermal Module Assembly 49
Detail A 52
Detail B 52
6 ATX Thermal/Mechanical 53
Appendix H 54
6.2.1 Heatsink Performance 55
6.2.2 Acoustics 56
6.2.3 Altitude 56
3.3 and 6.6) 57
6-3. Random Vibration PSD 58
6.3.2 Power Cycling 59
6.5 Safety Requirements 61
Thermal Mechanical Design 61
Less curvature in 62
Shock Load 62
Core shoulder 63
7 Intel 65
Quiet System 65
Technology (Intel 65
7-1. Intel 66
RPM Temperature 67
7-3 and listed below: 68
7-3. Intel 68
7.3 Intel 70
A.3.1, and A.3.2 76
Metrology 77
B.1 Overview 77
B.2 Test Preparation 77
Heatsink Clip Load Metrology 78
Load Cells (3x) 79
Preload Fixture (copper 79
B.3 Test Procedure Examples 80
Measurement 81
Appendix C Thermal Interface 83
Management 83
C.1 Bond Line Management 83
C.2 Interface Material Area 83
Thermal Interface Management 84
Appendix D Case Temperature 85
Reference Metrology 85
D.1 Objective and Scope 85
7-11. Order 86
7-11. Omega Thermocouple 86
D.4 IHS Groove 87
7-14 for the 775-Land 90
D.2 and D.3 91
7-16) 91
7-17) 91
7-19-A and B) 92
TC Wire with Insulation 94
IHS with Groove 94
7-24) 95
7-25) 96
7-25. Cutting Solder 96
7-26) 96
D.5.3 Solder Process 97
7-27. Solder Station Setup 98
7-28 and Figure 7-29) 98
Installation 100
7-32) 101
7-33) 101
7-34) 102
7-36) 103
Extended (BTX) System 105
Thermal Considerations 105
Thermal 107
MCH Heatsink 107
Reference Design 109
BOARD PRIMARY SIDE 112
BOARD SECONDARY SIDE 113
Mechanical Drawings 114
Figure 7-54. Intel 126
Appendix H Intel 127
Enabled Reference 127
Solution Information 127

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