Intel AT80601000921AB Arkusz Danych Pobierz pdf (Strona 101)

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Intel® Xeon® Processor 3500 Series Datasheet Volume 1 101

Boxed Processor Specifications

Notes:

1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical

representation.

Figure 8-3. Space Requirements for the Boxed Processor (top view)

Figure 8-4. Space Requirements for the Boxed Processor (overall view)

1 2 ... 96 97 98 99 100 101 102 103 104 105 106

Processor 3500 Series 1
Contents 3
Revision History 7
1 Introduction 9
1.1 Terminology 10
1.2 References 11
Introduction 12
2 Electrical Specifications 13
Electrical Specifications 14
2.7 Signal Groups 18
DC Specifications 20
2.9.2 Input Device Hysteresis 21
Table 2-8. V 24
Table 2-10. V 26
Figure 2-4. V 27
2.11.2 V 29
Overshoot Specification 29
2.11.3 Die Voltage Validation 30
3 Package Mechanical 31
3.7 Processor Materials 35
3.8 Processor Markings 35
Processor 3500 37
Series Land Listing 37
(Sheet 1 of 36) 38
(Sheet 2 of 36) 38
(Sheet 3 of 36) 39
(Sheet 4 of 36) 39
(Sheet 5 of 36) 40
(Sheet 6 of 36) 40
(Sheet 7 of 36) 41
(Sheet 8 of 36) 41
(Sheet 9 of 36) 42
(Sheet 10 of 36) 42
(Sheet 11 of 36) 43
(Sheet 12 of 36) 43
(Sheet 13 of 36) 44
(Sheet 14 of 36) 44
(Sheet 15 of 36) 45
(Sheet 16 of 36) 45
(Sheet 17 of 36) 46
(Sheet 18 of 36) 46
(Sheet 19 of 36) 47
(Sheet 20 of 36) 47
(Sheet 21 of 36) 48
(Sheet 22 of 36) 48
(Sheet 23 of 36) 49
(Sheet 24 of 36) 49
(Sheet 25 of 36) 50
(Sheet 26 of 36) 50
(Sheet 27 of 36) 51
(Sheet 28 of 36) 51
(Sheet 29 of 36) 52
(Sheet 30 of 36) 52
(Sheet 31 of 36) 53
(Sheet 32 of 36) 53
(Sheet 33 of 36) 54
(Sheet 34 of 36) 54
(Sheet 35 of 36) 55
(Sheet 36 of 36) 55
5 Signal Definitions 75
System board 76
6 Thermal Specifications 79
CASE_MAX 81
6.1.2 Thermal Metrology 83
6.2.1 Processor Temperature 84
6.2.2.1 Frequency/VID Control 85
6.2.2.2 Clock Modulation 86
6.2.2.5 PROCHOT# Signal 87
6.3.1 Introduction 88
6.3.2.1 PECI Device Address 89
6.3.2.2 PECI Command Support 89
Error Code Description 90
8000h General sensor error 90
Thermal Specifications 92
7 Features 93
7.2.1.1 C0 State 94
7.2.1.2 C1/C1E State 94
7.2.1.3 C3 State 95
7.2.1.4 C6 State 95
7.2.2.1 Package C0 State 95
7.2.2.2 Package C1/C1E State 95
7.2.2.3 Package C3 State 95
7.2.2.4 Package C6 State 96
7.5 Enhanced Intel SpeedStep 97
Technology 97
Features 98
8.1 Introduction 99
8.2 Mechanical Specifications 100
8.3 Electrical Requirements 102
8.4 Thermal Specifications 103
8.4.2 Variable Speed Fan 105

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