Intel AT80571AH0722ML Arkusz Danych Strona 84
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Oceniono. / 5. Na podstawie oceny klientów
Case Temperature Reference Metrology
84 Thermal and Mechanical Design Guidelines
Item Description Part Number
Miscellaneous Hardware
Solder Indium Corp. of America
Alloy 57BI / 42SN / 1AG 0.010 Diameter
52124
Flux Indium Corp. of America 5RMA
Loctite* 498
Adhesive
Super glue w/thermal characteristics 49850
Adhesive
Accelerator
Loctite* 7452 for fast glue curing 18490
Kapton* Tape For holding thermocouple in place Not Available
Thermocouple Omega *,36 gauge, “T” Type
(see note 2 for ordering information)
OSK2K1280/5SR
TC-TT-T-36-72
Calibration and Control
Ice Point Cell Omega*, stable 0 ºC temperature source for
calibration and offset
TRCIII
Hot Point Cell Omega *, temperature source to control and
understand meter slope gain
CL950-A-110
NOTES:
1. The Solder Station consisting of the Heater Block, Heater, Press and Transformer are
available from Jemelco Engineering 480-804-9514
2. This part number is a custom part with the specified insulation trimming and packaging
requirements necessary for quality thermocouple attachment, See Figure 7-11. Order
from Omega Anthony Alvarez, Direct phone (203) 359-7671,
Direct fax (203) 968-7142, E-Mail: aalvarez@omega.com
Figure 7-11. Omega Thermocouple
- Contents 3
- Figures 6
- Revision History 8
- 1 Introduction 9
- 1.1.3 Document Scope 10
- 1.2 References 11
- 1.3 Definition of Terms 11
- Ψ measurements 12
- Information 13
- 2.1.2 Heatsink Attach 15
- 2.2 Thermal Requirements 16
- 2.2.2 Thermal Profile 17
- 2.2.4 T 18
- 2.3.1 Heatsink Size 20
- 2.3.2 Heatsink Mass 20
- 2.3.3 Package IHS Flatness 21
- 2.4.3 Summary 23
- 3 Thermal Metrology 25
- 3.1.1 Example 26
- Assessment 27
- Guidelines 27
- Thermal Metrology 28
- Thermal Monitor Feature 31
- 4.2.1 PROCHOT# Signal 32
- 4.2.3 Thermal Monitor 2 33
- 4.2.5 On-Demand Mode 35
- 4.2.6 System Considerations 35
- Considerations 36
- 4.2.8 THERMTRIP# Signal 36
- (BTX) Thermal/Mechanical 39
- Design Information 39
- 5.1.2 Acoustics 40
- 5.1.3 Effective Fan Curve 41
- Airflow (cfm) 42
- 5.1.5 Altitude 43
- 5.2.2 Power Cycling 45
- 5.4 Safety Requirements 47
- Reference BTX 47
- Thermal Module Assembly 47
- Less curvature in region 48
- Shock Load 48
- 6 ATX Thermal/Mechanical 51
- 6.2.1 Heatsink Performance 53
- 6.2.2 Acoustics 54
- 6.2.3 Altitude 54
- PSD (g^2/Hz) 56
- 6.3.2 Power Cycling 57
- 6.5 Safety Requirements 59
- Reference ATX 59
- Thermal Mechanical Design 59
- Less curvature in 60
- Core shoulder 61
- Φ36.14 +/- 0.10 mm 62
- Φ38.68 +/- 0.30 mm 62
- 7 Intel 63
- Quiet System 63
- Technology (Intel 63
- (Output Weighting Matrix) 64
- RPM Temperature 65
- Intel® (G)MCH 66
- 7.3 Intel 68
- Loading 69
- Metrology 75
- Heatsink Clip Load Metrology 76
- Load Cells (3x) 77
- Preload Fixture (copper 77
- B.3 Test Procedure Examples 78
- Measurement 79
- Appendix C Thermal Interface 81
- Management 81
- Thermal Interface Management 82
- Appendix D Case Temperature 83
- Reference Metrology 83
- D.4 IHS Groove 85
- TC Wire with Insulation 92
- IHS with Groove 92
- D.5.3 Solder Process 95
- Installation 98
- Extended (BTX) System 103
- Thermal Considerations 103
- TMA Airflow 105
- Reference Design 107
- BOARD PRIMARY SIDE 110
- BOARD SECONDARY SIDE 111
- Mechanical Drawings 112
- Figure 7-54. Intel 124
- Appendix H Intel 125
- Enabled Reference 125
- Solution Information 125
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