Intel WiFi Link 5100 Instrukcja Użytkownika Strona 11

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Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 11
Intel
®
5100 MCH Chipset
2.1 Package Mechanical Requirements
The Intel
®
5100 MCH Chipset package has an integrated heat spreader (IHS) that is
capable of sustaining a maximum static normal load of 15 lbf. These mechanical load
limits must not be exceeded during heatsink installation, mechanical stress testing,
standard shipping conditions and/or any other use condition.
Note: The heatsink attach solutions must not include continuous stress to the chipset
package with the exception of a uniform load to maintain the heatsink-to-package
thermal interface.
Figure 4. MCH Package Dimensions (Bottom View)
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
42.5 + 0.05
11 252321191715139753127293733 3531
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AN
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AU
AH
AF
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42.5 + 0.05
C A0.2
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37X 1.092
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20.202
37X 1.092
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