Intel CELERON 200 Instrukcja Użytkownika Pobierz pdf (Strona 9)

Introduction

Thermal and Mechanical Design Guidelines 9

1.2 Reference Documents

Material and concepts available in the following documents may be beneficial when

reading this document.

Document Document

No./Location

Intel

Celeron

Processor 200 Sequence Datasheet http://developer.intel

.com/design/processo

r/datashts/318546.ht

Power Supply Design Guide for Desktop Platform Form Factors (Rev

1.1)

http://www.formfacto

rs.org/

ATX Thermal Design Suggestions http://www.formfactors.

org/

microATX Thermal Design Suggestions http://www.formfactors.

org/

Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.

org/

Thermally Advantaged Chassis version 1.1 http://www.intel.com/g

o/chassis/

1.3 Definition of Terms

Term Description

The measured ambient temperature locally surrounding the processor. The

ambient temperature should be measured just upstream of a passive heatsink or

at the fan inlet for an active heatsink.

Processor junction temperature.

S-TOP

Heatsink temperature measured at vicinity to center on the top surface of

heatsink base.

Junction-to-ambient thermal characterization parameter (psi). A measure of

thermal solution performance using total package power. Defined as

– T

) / Total Package Power.

Note: Heat source must be specified for Ψ measurements.

Junction-to-sink thermal characterization parameter. A measure of thermal

interface material performance using total package power. Defined as

– T

) / Total Package Power.

Note: Heat source must be specified for Ψ measurements.

Sink-to-ambient thermal characterization parameter. A measure of heatsink

thermal performance using total package power. Defined as

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