Intel CELERON 200 Instrukcja Użytkownika Pobierz pdf (Strona 18)

Processor Thermal/Mechanical Information

18 Thermal and Mechanical Design Guidelines

Figure 4. Vertical Lock-Down Alignment Feature

Figure 5. Various Types of Solder Crack

2.2 Thermal Requirements

The processor requires a thermal solution to maintain temperatures within operating

limits. Refer to the datasheet for the processor thermal specifications.

To allow for the optimal operation and long-term reliability of Intel processor-based

systems, the system/processor thermal solution should remain within the minimum

and maximum junction temperature specifications at corresponding thermal design

power (TDP) as listed in datasheet.

The thermal limits for the processor are the junction temperature (T

). The T

defines

the maximum junction temperature as a function of power being dissipated.

Designing to this specification allows optimization of thermal designs for processor

performance.

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Intel CELERON 200 Instrukcja Użytkownika Strona 18