Intel CELERON 200 Instrukcja Użytkownika

318548-001 Intel® Celeron® Processor 200Δ Sequence Thermal and Mechanical Design Guidelines — Supporting the Intel® Celeron® processor 220 Δ

Introduction 10 Thermal and Mechanical Design Guidelines Term Description (TS – TA) / Total Package Power. Note: Heat source must be specified

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 11 2 Processor Thermal/Mechanical Information 2.1 Mechanical

Processor Thermal/Mechanical Information 12 Thermal and Mechanical Design Guidelines Table 1. Micro-FCBGA Package Mechanical Specifications S

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 13 Figure 1. Micro-FCBGA Processor Package Drawing – Isometric

Processor Thermal/Mechanical Information 14 Thermal and Mechanical Design Guidelines Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 15 Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of

Processor Thermal/Mechanical Information 16 Thermal and Mechanical Design Guidelines 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines The m

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 17 depending on clip stiffness, the initial preload at beginnin

Processor Thermal/Mechanical Information 18 Thermal and Mechanical Design Guidelines Figure 4. Vertical Lock-Down Alignment Feature Figure 5

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 19 2.2.1 Processor Junction Temperature Table 2. Thermal Spec

2 Thermal and Mechanical Design Guidelines INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENS

Processor Thermal/Mechanical Information 20 Thermal and Mechanical Design Guidelines air, TA, and the local air velocity over the surface. The

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 21 2.3.2 Heatsink Mass With the need to push air cooling to be

Processor Thermal/Mechanical Information 22 Thermal and Mechanical Design Guidelines 2.4 System Thermal Solution Considerations 2.4.1 Chassi

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 23 By analyzing airflow condition in an μATX chassis, a case st

Processor Thermal/Mechanical Information 24 Thermal and Mechanical Design Guidelines Figure 7. Case Study #2: Relocate System Fan to CAG Venti

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 25 Figure 9. Case Study #4: A “Top Mount Fan” PSU is located n

Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines

Thermal Metrology Thermal and Mechanical Design Guidelines 27 3 Thermal Metrology This section discusses guidelines for testing thermal solution

Thermal Metrology 28 Thermal and Mechanical Design Guidelines For reference thermal solution of Intel Celeron processor 200 sequence on Intel D

Thermal Metrology Thermal and Mechanical Design Guidelines 29 Figure 10 illustrates the combination of the different thermal characterization pa

Thermal and Mechanical Design Guidelines 3 Contents 1 Introduction ...

Thermal Metrology 30 Thermal and Mechanical Design Guidelines To determine the required heatsink performance, a heatsink solution provider woul

Thermal Metrology Thermal and Mechanical Design Guidelines 31 measurements will reveal a highly non-uniform temperature distribution across the i

Thermal Metrology 32 Thermal and Mechanical Design Guidelines Figure 12. Locations for Measuring Local Ambient Temperature, Passive Heatsink

Thermal Metrology Thermal and Mechanical Design Guidelines 33 3.3.1 Sample Preparation In order to accurately measure the processor power consum

Thermal Metrology 34 Thermal and Mechanical Design Guidelines Figure 13. Precision Resistor Connected in-series with Processor Circuitry for Po

Thermal Metrology Thermal and Mechanical Design Guidelines 35 Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 KΩ) on Inte

Thermal Metrology 36 Thermal and Mechanical Design Guidelines

System Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 37 4 System Thermal/Mechanical Design Information 4.1 Ove

System Thermal/Mechanical Design Information 38 Thermal and Mechanical Design Guidelines 4.2 Environmental Reliability Testing 4.2.1 Structur

System Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 39 Figure 18. Shock Acceleration Curve 0102030405060024 6

4 Thermal and Mechanical Design Guidelines Appendix A Heatsink Clip Load Metrology...

System Thermal/Mechanical Design Information 40 Thermal and Mechanical Design Guidelines 4.2.2 Power Cycling Thermal performance degradation d

System Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 41 4.4 Safety Requirements Heatsink and attachment assembl

System Thermal/Mechanical Design Information 42 Thermal and Mechanical Design Guidelines

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 43 Appendix A Heatsink Clip Load Metrology A.1 Overview The primary objec

Heatsink Clip Load Metrology 44 Thermal and Mechanical Design Guidelines Table 5. Typical Test Equipment 7. Item 18. Description 9. Part N

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 45 A.3 Test Procedure Examples The following procedure is for a generic z

Heatsink Clip Load Metrology 46 Thermal and Mechanical Design Guidelines Figure 20. Anchors Installed and Glued Down the BTX Base Plate – for

Intel® Enabled Boxed Processor Thermal Solution Information Thermal and Mechanical Design Guidelines 47 Appendix B Intel® Enabled Boxed Processo

Intel® Enabled Boxed Processor Thermal Solution Information 48 Thermal and Mechanical Design Guidelines

Mechanical Drawings Thermal and Mechanical Design Guidelines 49 Appendix C Mechanical Drawings The following table lists the mechanical drawings

Thermal and Mechanical Design Guidelines 5 Tables Table 1. Micro-FCBGA Package Mechanical Specifications ...1

Mechanical Drawings 50 Thermal and Mechanical Design Guidelines Figure 21. Motherboard Keep-out Footprint Definition and Height Restrictions f

Mechanical Drawings Thermal and Mechanical Design Guidelines 51 Figure 22. Reference Clip E21952-001

Mechanical Drawings 52 Thermal and Mechanical Design Guidelines Figure 23. Reference Heatsink D96271-001

Mechanical Drawings Thermal and Mechanical Design Guidelines 53 Figure 24. Intel® Boxed Processor Thermal Solution E21953-001 §

6 Thermal and Mechanical Design Guidelines Revision History Revision Number Description Revision Date -001 • Initial Release October 2007

Introduction Thermal and Mechanical Design Guidelines 7 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The

Introduction 8 Thermal and Mechanical Design Guidelines 1.1.3 Document Scope This design guide supports the following processors: • Intel® Ce

Introduction Thermal and Mechanical Design Guidelines 9 1.2 Reference Documents Material and concepts available in the following documents may b