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Package Mechanical Specifications and Pin Information
38
Datasheet
Figure 7.
SFF (ULV DC) Die Micro-
FCBGA Processor Package Drawing
ø
0.14
A
A
B
L
C
ø
0.04
ø
0.46±0.04
(Metal Diameter)
ø
0.39±0.02
(Solder Resist Opening)
L
1
2
...
33
34
35
36
37
38
39
40
41
42
43
...
97
98
Dual-Core on 45-nm Process
1
2 Datasheet
2
Contents
3
4 Datasheet
4
Revision History
5
6 Datasheet
6
1 Introduction
7
1.1 Terminology
8
1.2 References
9
Introduction
10
10 Datasheet
10
2 Low Power Features
11
2.1.1 Core Low-Power States
12
Datasheet 13
13
Low Power Features
13
2.1.2.4 Sleep State
14
2.1.2.6 Deeper Sleep State
15
2.1.2.5 Deep Sleep State
15
2.3 Low-Power FSB Features
16
Datasheet 17
17
18 Datasheet
18
3 Electrical Specifications
19
3.5 Reserved and Unused Pins
22
3.7 FSB Signal Groups
23
Table 4. FSB Pin Groups
24
3.8 CMOS Signals
25
3.9 Maximum Ratings
25
Electrical Specifications
26
26 Datasheet
26
Processors
28
4 Package Mechanical
33
Specifications and Pin
33
Information
33
34 Datasheet
34
Datasheet 35
35
36 Datasheet
36
Datasheet 37
37
38 Datasheet
38
(Sheet 1 of 2)
39
(Sheet 2 of 2)
40
Datasheet 41
41
42 Datasheet
42
Datasheet 43
43
44 Datasheet
44
(Sheet 1 of 16)
45
(Sheet 2 of 16)
45
(Sheet 3 of 16)
46
(Sheet 4 of 16)
46
(Sheet 5 of 16)
47
(Sheet 6 of 16)
47
(Sheet 7 of 16)
48
(Sheet 8 of 16)
48
(Sheet 9 of 16)
49
(Sheet 10 of 16)
49
(Sheet 11 of 16)
50
(Sheet 12 of 16)
50
(Sheet 13 of 16)
51
(Sheet 14 of 16)
51
(Sheet 2 of 17)
53
(Sheet 3 of 17)
53
(Sheet 4 of 17)
54
(Sheet 5 of 17)
54
(Sheet 6 of 17)
55
(Sheet 7 of 17)
55
(Sheet 8 of 17)
56
(Sheet 9 of 17)
56
(Sheet 10 of 17)
57
(Sheet 11 of 17)
57
(Sheet 12 of 17)
58
(Sheet 13 of 17)
58
(Sheet 14 of 17)
59
(Sheet 15 of 17)
59
(Sheet 16 of 17)
60
(Sheet 17 of 17)
60
74 Datasheet
74
together with V
81
82 Datasheet
82
5 Thermal Specifications and
83
Design Considerations
83
5.1.1 Thermal Diode
85
5.1.2 Thermal Diode Offset
87
5.1.3 Intel® Thermal Monitor
88
5.1.4 Digital Thermal Sensor
89
5.1.6 PROCHOT# Signal Pin
90
Datasheet 91
91
92 Datasheet
92
Datasheet 1
93
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