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Intel
®
Pentium
®
D Processor 800
Δ
Sequence
Datasheet
– On 90 nm Process in the 775-land LGA Package and supporting
Intel
®
Extended Memory 64 Technology
Φ
February 2006
Document Number: 307506-003
Przeglądanie stron 0
1 2 3 4 5 6 ... 105 106

Podsumowanie treści

Strona 1 - Sequence

Intel® Pentium® D Processor 800Δ Sequence Datasheet– On 90 nm Process in the 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ

Strona 2

10 Datasheet Contents

Strona 3

100 Datasheet Balanced Technology Extended (BTX) Type I Boxed Processor SpecificationsThe fan heatsink receives a PWM signal from the motherboard fro

Strona 4 - 4 Datasheet

Datasheet 101Balanced Technology Extended (BTX) Type I Boxed Processor Specifications8.3 Thermal SpecificationsThis section describes the cooling req

Strona 5 - Datasheet 5

102 Datasheet Balanced Technology Extended (BTX) Type I Boxed Processor Specifications8.3.2 Variable Speed FanIf the boxed processor fan heatsink 4-p

Strona 6 - 6 Datasheet

Datasheet 103Balanced Technology Extended (BTX) Type I Boxed Processor SpecificationsIf the boxed processor TMA 4-pin connector is connected to a 4-p

Strona 7 - Revision History

104 Datasheet Balanced Technology Extended (BTX) Type I Boxed Processor Specifications

Strona 8

Datasheet 105Debug Tools Specifications9 Debug Tools SpecificationsRefer to the eXtended Debug Port: Debug Port Design Guide for UP and DP Platforms

Strona 9 - Sequence Features

106 Datasheet Debug Tools Specifications

Strona 10 - Contents

Datasheet 11Introduction1 IntroductionThe Intel® Pentium® D processor extends Intel's Desktop dual-core product line. The Pentium D processor us

Strona 11 - 1 Introduction

12 Datasheet Introduction1.1 TerminologyA ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active state w

Strona 12 - 1.1 Terminology

Datasheet 13Introduction1.2 ReferencesMaterial and concepts available in the following documents may be beneficial when reading this document:§Table

Strona 13 - 1.2 References

14 Datasheet Introduction

Strona 14 - Introduction

Datasheet 15Electrical Specifications2 Electrical Specifications This chapter describes the electrical characteristics of the processor interfaces an

Strona 15 - 2 Electrical Specifications

16 Datasheet Electrical Specifications2.2.3 FSB DecouplingThe Pentium D processor package integrates signal termination on the die as well as incorpo

Strona 16 - 2.3 Voltage Identification

Datasheet 17Electrical SpecificationsTable 2-1. Voltage Identification DefinitionVID5 VID4 VID3 VID2 VID1 VID0 VID VID5 VID4 VID3 VID2 VID1 VID0 VID0

Strona 17 - Electrical Specifications

18 Datasheet Electrical Specifications2.4 Reserved, Unused, FC and TESTHI SignalsAll RESERVED lands must remain unconnected. Connection of these land

Strona 18 - 18 Datasheet

Datasheet 19Electrical Specifications2.5 Voltage and Current Specifications2.5.1 Absolute Maximum and Minimum RatingsTable 2-2 specifies absolute max

Strona 19 - Datasheet 19

2 Datasheet ContentsINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWI

Strona 20 - (PRB = 0)

20 Datasheet Electrical SpecificationsTable 2-3. Voltage and Current SpecificationsSymbol Parameter Min Typ Max Unit NotesVID range VID 1.200 — 1.400

Strona 21 - Table 2-4. V

Datasheet 21Electrical Specifications5. 775_VR_CONFIG_05A and 775_VR_CONFIG_05B refer to voltage regulator configurations that are defined in the Vol

Strona 22 - Processor

22 Datasheet Electrical SpecificationsNOTES:1. The loadline specification includes both static and transient limits except for overshoot allowed as s

Strona 23 - Table 2-5. V

Datasheet 23Electrical SpecificationsTable 2-5. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D ProcessorIcc (A) Voltage Deviation

Strona 24 - Figure 2-2. V

24 Datasheet Electrical SpecificationsFigure 2-2. VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D ProcessorVID - 0.000VID - 0.02

Strona 25 - Overshoot Specification

Datasheet 25Electrical Specifications2.5.3 VCC Overshoot SpecificationThe Pentium D processor can tolerate short transient overshoot events where VCC

Strona 26 - 2.6 Signaling Specifications

26 Datasheet Electrical Specifications2.5.4 Die Voltage ValidationOvershoot events on the processor must meet the specifications in Table 2-6 when me

Strona 27 - Table 2-7. FSB Signal Groups

Datasheet 27Electrical SpecificationsTable 2-8 outlines the signals which include on-die termination (RTT). Open drain signals are also included. Tab

Strona 28 - 28 Datasheet

28 Datasheet Electrical Specifications2.6.2 GTL+ Asynchronous SignalsThe signals A20M#, IGNNE#, INIT#, SMI#, and STPCLK# utilize CMOS input buffers.

Strona 29 - 2.6.3 FSB DC Specifications

Datasheet 29Electrical Specifications2.6.3 FSB DC SpecificationsThe processor front side bus DC specifications in this section are defined at the pro

Strona 30

Datasheet 3ContentsContents1 Introduction...

Strona 31 - Datasheet 31

30 Datasheet Electrical SpecificationsTable 2-12. PWRGOOD Input and TAP Signal Group DC SpecificationsSymbol Parameter Min Max Unit Notes1, 2NOTES:1.

Strona 32 - 2.7 Clock Specifications

Datasheet 31Electrical Specifications2.6.3.1 GTL+ Front Side Bus SpecificationsIn most cases, termination resistors are not required as these are int

Strona 33 - Datasheet 33

32 Datasheet Electrical Specifications2.7 Clock Specifications2.7.1 FSB Clock (BCLK[1:0]) and Processor ClockingBCLK[1:0] directly controls the FSB i

Strona 34

Datasheet 33Electrical Specifications2.7.3 Phase Lock Loop (PLL) and FilterVCCA and VCCIOPLL are power sources required by the PLL clock generators f

Strona 35 - 3 Package Mechanical

34 Datasheet Electrical SpecificationsNOTES:1. Diagram not to scale.2. No specifications for frequencies beyond fcore (core frequency).3. fpeak, if e

Strona 36 - 36 Datasheet

Datasheet 35Package Mechanical Specifications3 Package Mechanical Specifications The Intel® Pentium® D processor is packaged in a Flip-Chip Land Grid

Strona 37 - Datasheet 37

36 Datasheet Package Mechanical SpecificationsFigure 3-2. Processor Package Drawing 1

Strona 38 - 38 Datasheet

Datasheet 37Package Mechanical SpecificationsFigure 3-3. Processor Package Drawing 2

Strona 39 - Datasheet 39

38 Datasheet Package Mechanical SpecificationsFigure 3-4. Processor Package Drawing 3

Strona 40 - 3.8 Processor Markings

Datasheet 39Package Mechanical Specifications3.2 Processor Component Keep-Out ZonesThe processor may contain components on the substrate that define

Strona 41 - D Processor 805)

4 Datasheet Contents5.2 Processor Thermal Features ...795.2

Strona 42 - 42 Datasheet

40 Datasheet Package Mechanical Specifications3.5 Package Insertion SpecificationsThe Pentium D processor can be inserted into and removed from a LGA

Strona 43 - 4 Land Listing and Signal

Datasheet 41Package Mechanical SpecificationsFigure 3-6. Processor Top-Side Marking Example (Intel® Pentium® D Processor 805)ATPOS/NProcessor Number/

Strona 44 - 44 Datasheet

42 Datasheet Package Mechanical Specifications3.9 Processor Land CoordinatesFigure 3-7 shows the top view of the processor land coordinates. The coor

Strona 45 - Datasheet 45

43 Datasheet Land Listing and Signal Descriptions4 Land Listing and Signal DescriptionsThis chapter provides the processor land assignment and signal

Strona 46 - Assignments

44 Datasheet Land Listing and Signal DescriptionsFigure 4-1. Landout Diagram (Top View – Left Side)30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15ANV

Strona 47

Datasheet 45Land Listing and Signal DescriptionsFigure 4-2. Landout Diagram (Top View – Right Side)14 13 12 11 10 9 8 7 6 5 4 3 2 1VCC VSS VCC VCC VS

Strona 48

Land Listing and Signal Descriptions46 Datasheet Table 4-1. Alphabetical Land AssignmentsLand NameLand #Signal Buffer TypeDirectionA3# L5 Source Synch

Strona 49

Land Listing and Signal DescriptionsDatasheet 47D21# E10 Source Synch Input/OutputD22# D10 Source Synch Input/OutputD23# F11 Source Synch Input/Output

Strona 50

Land Listing and Signal Descriptions48 Datasheet GTLREF1 H2 Power/Other InputHIT# D4 Common Clock Input/OutputHITM# E4 Common Clock Input/OutputIERR#

Strona 51

Land Listing and Signal DescriptionsDatasheet 49VCC AC27 Power/Other VCC AC28 Power/Other VCC AC29 Power/Other VCC AC30 Power/Other VCC AC8 Power/

Strona 52

Datasheet 5ContentsFigures2-1 VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor...222-2 VCC Static and Transient

Strona 53

Land Listing and Signal Descriptions50 Datasheet VCC AK14 Power/Other VCC AK15 Power/Other VCC AK18 Power/Other VCC AK19 Power/Other VCC AK21 Powe

Strona 54

Land Listing and Signal DescriptionsDatasheet 51VCC K30 Power/Other VCC K8 Power/Other VCC L8 Power/Other VCC M23 Power/Other VCC M24 Power/Other

Strona 55

Land Listing and Signal Descriptions52 Datasheet VSS AA24 Power/Other VSS AA25 Power/Other VSS AA26 Power/Other VSS AA27 Power/Other VSS AA28 Powe

Strona 56 - 56 Datasheet

Land Listing and Signal DescriptionsDatasheet 53VSS AJ23 Power/Other VSS AJ24 Power/Other VSS AJ27 Power/Other VSS AJ28 Power/Other VSS AJ29 Power

Strona 57 - Datasheet 57

Land Listing and Signal Descriptions54 Datasheet VSS E11 Power/Other VSS E14 Power/Other VSS E17 Power/Other VSS E2 Power/Other VSS E20 Power/Othe

Strona 58 - 58 Datasheet

Land Listing and Signal DescriptionsDatasheet 55VSS R30 Power/Other VSS R5 Power/Other VSS R7 Power/Other VSS T3 Power/Other VSS T6 Power/Other V

Strona 59 - Datasheet 59

Land Listing and Signal Descriptions56 Datasheet Table 4-2. Numerical Land AssignmentLand #Land NameSignal Buffer TypeDirectionA2 VSS Power/Other A3

Strona 60 - 60 Datasheet

Land Listing and Signal DescriptionsDatasheet 57C24 VSS Power/Other C25 VTT Power/Other C26 VTT Power/Other C27 VTT Power/Other C28 VTT Power/Othe

Strona 61 - Datasheet 61

Land Listing and Signal Descriptions58 Datasheet F19 VSS Power/Other F20 D41# Source Synch Input/OutputF21 D43# Source Synch Input/OutputF22 VSS Powe

Strona 62 - 62 Datasheet

Land Listing and Signal DescriptionsDatasheet 59J12 VCC Power/Other J13 VCC Power/Other J14 VCC Power/Other J15 VCC Power/Other J16 DP0# Common Cl

Strona 63 - Datasheet 63

6 Datasheet ContentsTables1-1 References ...

Strona 64 - 64 Datasheet

Land Listing and Signal Descriptions60 Datasheet N30 VCC Power/Other P1 TESTHI11 Power/Other InputP2 SMI# Asynch GTL+ InputP3 INIT# Asynch GTL+ Input

Strona 65 - Datasheet 65

Land Listing and Signal DescriptionsDatasheet 61W2 TESTHI12 Power/Other InputW3 TESTHI1 Power/Other InputW4 VSS Power/Other W5 A16# Source Synch Inpu

Strona 66 - 66 Datasheet

Land Listing and Signal Descriptions62 Datasheet AD4 VSS Power/Other AD5 ADSTB1# Source Synch Input/OutputAD6 A22# Source Synch Input/OutputAD7 VSS P

Strona 67 - Datasheet 67

Land Listing and Signal DescriptionsDatasheet 63AG10 VSS Power/Other AG11 VCC Power/Other AG12 VCC Power/Other AG13 VSS Power/Other AG14 VCC Power

Strona 68 - 68 Datasheet

Land Listing and Signal Descriptions64 Datasheet AK2 VSS Power/Other AK3 ITP_CLK0 TAP InputAK4 VID4 Power/Other OutputAK5 VSS Power/Other AK6 FORCEP

Strona 69 - Datasheet 69

Land Listing and Signal DescriptionsDatasheet 65AM24 VSS Power/Other AM25 VCC Power/Other AM26 VCC Power/Other AM27 VSS Power/Other AM28 VSS Power

Strona 70 - 70 Datasheet

66 Datasheet Land Listing and Signal Descriptions4.2 Alphabetical Signals ReferenceTable 4-3. Signal Description (Sheet 1 of 8)Name Type Description

Strona 71 - Datasheet 71

Datasheet 67Land Listing and Signal DescriptionsBINIT#Input/OutputBINIT# (Bus Initialization) may be observed and driven by all processor FSB agents

Strona 72 - 72 Datasheet

68 Datasheet Land Listing and Signal DescriptionsD[63:0]#Input/OutputD[63:0]# (Data) are the data signals. These signals provide a 64-bit data path b

Strona 73 - Datasheet 73

Datasheet 69Land Listing and Signal DescriptionsDRDY#Input/OutputDRDY# (Data Ready) is asserted by the data driver on each data transfer, indicating

Strona 74 - 74 Datasheet

Datasheet 7ContentsRevision History§Revision NumberDescription Date-001 • Initial release May 2005-002• Added Balanced Technology Extended (BTX) Type

Strona 75 - 5 Thermal Specifications and

70 Datasheet Land Listing and Signal DescriptionsIERR# OutputIERR# (Internal Error) is asserted by a processor as the result of an internal error. As

Strona 76 - 76 Datasheet

Datasheet 71Land Listing and Signal DescriptionsMCERR#Input/OutputMCERR# (Machine Check Error) is asserted to indicate an unrecoverable error without

Strona 77 - Datasheet 77

72 Datasheet Land Listing and Signal DescriptionsRSP# InputRSP# (Response Parity) is driven by the response agent (the agent responsible for completi

Strona 78 - 78 Datasheet

Datasheet 73Land Listing and Signal Descriptions§TMS InputTMS (Test Mode Select) is a JTAG specification support signal used by debug tools.TRDY# Inp

Strona 79 - Datasheet 79

74 Datasheet Land Listing and Signal Descriptions

Strona 80 - 5.2.3 PROCHOT# Signal

Datasheet 75Thermal Specifications and Design Considerations5 Thermal Specifications and Design Considerations5.1 Processor Thermal SpecificationsThe

Strona 81 - 5.2.4 FORCEPR# Signal Pin

76 Datasheet Thermal Specifications and Design ConsiderationsRefer to the Intel® Pentium® D Processor and Intel® Pentium® Processor Extreme Edition 8

Strona 82 - 82 Datasheet

Datasheet 77Thermal Specifications and Design ConsiderationsTable 5-2. Thermal Profile for the Pentium D Processor with PRB=1Power (W)Maximum TC (°C)

Strona 83 - Datasheet 83

78 Datasheet Thermal Specifications and Design ConsiderationsTable 5-3. Thermal Profile for the Pentium D Processor with PRB=0Power (W)Maximum TC (°C

Strona 84 - 84 Datasheet

Datasheet 79Thermal Specifications and Design Considerations5.1.2 Thermal MetrologyThe maximum and minimum case temperatures (TC) are specified in Ta

Strona 85 - 6 Features

8 Datasheet Contents

Strona 86 - 86 Datasheet

80 Datasheet Thermal Specifications and Design ConsiderationsWith a properly designed and characterized thermal solution, it is anticipated that the

Strona 87 - 6.2.3 Stop-Grant State

Datasheet 81Thermal Specifications and Design ConsiderationsAs a bi-directional signal, PROCHOT# allows for some protection of various components fro

Strona 88 - Technology

82 Datasheet Thermal Specifications and Design Considerations5.2.5 THERMTRIP# SignalRegardless of whether or not the Thermal Monitor feature is enabl

Strona 89 - Datasheet 89

Datasheet 83Thermal Specifications and Design Considerations§Table 5-5. Thermal Diode InterfaceSignal Name Land Number Signal DescriptionTHERMDA AL1

Strona 90 - 7.1 Mechanical Specifications

84 Datasheet Thermal Specifications and Design Considerations

Strona 91 - 7.2 Electrical Requirements

Datasheet 85Features6 Features6.1 Power-On Configuration OptionsSeveral configuration options can be configured by hardware. The Intel® Pentium® D pr

Strona 92 - 92 Datasheet

86 Datasheet Features6.2.1 Normal StateThis is the normal operating state for the processor.6.2.2 HALT and Enhanced HALT Powerdown StatesThe Pentium

Strona 93 - 7.3 Thermal Specifications

Datasheet 87FeaturesThe system can generate a STPCLK# while the processor is in the HALT Power Down state. When the system deasserts the STPCLK# inte

Strona 94 - 94 Datasheet

88 Datasheet Features6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop StateThe Enhanced HALT Snoop State is used in conjunction with the ne

Strona 95 - 7.3.2 Variable Speed Fan

Datasheet 89Boxed Processor Specifications7 Boxed Processor SpecificationsThe Intel® Pentium® D processor will also be offered as an Intel boxed proc

Strona 96 - 96 Datasheet

Datasheet 9ContentsIntel® Pentium® D Processor 800 Sequence FeaturesThe Intel® Pentium® D processor delivers Intel's advanced, powerful processo

Strona 97 - Specifications

90 Datasheet Boxed Processor Specifications7.1 Mechanical Specifications7.1.1 Boxed Processor Cooling Solution DimensionsThis section documents the m

Strona 98 - 8.1 Mechanical Specifications

Datasheet 91Boxed Processor Specifications7.1.2 Boxed Processor Fan Heatsink WeightThe boxed processor fan heatsink will not weigh more than 550 gram

Strona 99 - 8.2 Electrical Requirements

92 Datasheet Boxed Processor SpecificationsThe fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector labeled as C

Strona 100 - 100 Datasheet

Datasheet 93Boxed Processor Specifications7.3 Thermal SpecificationsThis section describes the cooling requirements of the fan heatsink solution util

Strona 101 - 8.3 Thermal Specifications

94 Datasheet Boxed Processor Specifications Figure 7-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)Figure 7-8. Boxed Pro

Strona 102 - 8.3.2 Variable Speed Fan

Datasheet 95Boxed Processor Specifications7.3.2 Variable Speed FanIf the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherb

Strona 103 - Datasheet 103

96 Datasheet Boxed Processor SpecificationsIf the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the mot

Strona 104 - 104 Datasheet

Datasheet 97Balanced Technology Extended (BTX) Type I Boxed Processor Specifications8 Balanced Technology Extended (BTX) Type I Boxed Processor Speci

Strona 105 - 9 Debug Tools Specifications

98 Datasheet Balanced Technology Extended (BTX) Type I Boxed Processor Specifications8.1 Mechanical Specifications8.1.1 Cooling Solution DimensionsTh

Strona 106 - Debug Tools Specifications

Datasheet 99Balanced Technology Extended (BTX) Type I Boxed Processor Specifications8.1.3 Boxed Processor Support and Retention Module (SRM)The boxed

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