Intel NE80546RE083256 Arkusz Danych Pobierz pdf (Strona 3)

Datasheet 3

Contents

1 Introduction.................................................................................................................9

1.1 Terminology .......................................................................................................9

1.1.1 Processor Packaging Terminology.............................................................10

1.2 References .......................................................................................................11

2 Electrical Specifications ...............................................................................................13

2.1 Power and Ground Lands....................................................................................13

2.2 Decoupling Guidelines........................................................................................13

2.2.1 VCC Decoupling .....................................................................................13

2.2.2 VTT Decoupling......................................................................................14

2.2.3 FSB Decoupling......................................................................................14

2.3 Voltage Identification.........................................................................................14

2.4 Reserved, Unused, and TESTHI Signals ................................................................16

2.5 Voltage and Current Specification........................................................................17

2.5.1 Absolute Maximum and Minimum Ratings ..................................................17

2.5.2 DC Voltage and Current Specification........................................................18

2.5.3 VCC Overshoot ......................................................................................21

2.5.4 Die Voltage Validation.............................................................................22

2.6 Signaling Specifications......................................................................................22

2.6.1 FSB Signal Groups..................................................................................23

2.6.2 GTL+ Asynchronous Signals.....................................................................25

2.6.3 Processor DC Specifications .....................................................................25

2.6.3.1 GTL+ Front Side Bus Specifications .............................................28

2.7 Clock Specifications...........................................................................................29

2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................29

2.7.2 FSB Frequency Select Signals (BSEL[2:0]).................................................30

2.7.3 Phase Lock Loop (PLL) and Filter ..............................................................30

2.7.4 BCLK[1:0] Specifications.........................................................................32

3 Package Mechanical Specifications ................................................................................33

3.1 Package Mechanical Drawing...............................................................................33

3.2 Processor Component Keep-Out Zones.................................................................37

3.3 Package Loading Specifications ...........................................................................37

3.4 Package Handling Guidelines...............................................................................37

3.5 Package Insertion Specifications..........................................................................38

3.6 Processor Mass Specification...............................................................................38

3.7 Processor Materials............................................................................................38

3.8 Processor Markings............................................................................................38

3.9 Processor Land Coordinates................................................................................39

4 Land Listing and Signal Descriptions .............................................................................41

4.1 Processor Land Assignments...............................................................................41

4.2 Alphabetical Signals Reference............................................................................64

5 Thermal Specifications and Design Considerations...........................................................75

5.1 Processor Thermal Specifications.........................................................................75

5.1.1 Thermal Specifications............................................................................75

5.1.2 Thermal Metrology .................................................................................79

5.2 Processor Thermal Features................................................................................79

5.2.1 Thermal Monitor.....................................................................................79

5.2.2 On-Demand Mode ..................................................................................80

5.2.3 PROCHOT# Signal..................................................................................81

5.2.4 THERMTRIP# Signal ...............................................................................81

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