Intel LF80537GG0252M Arkusz Danych Pobierz pdf (Strona 55)

Package Mechanical Specifications and Pin Information

Datasheet 55

Figure 12. 3-MB Die Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)

B6741-01

D93702(1)

TOP VIEW

FRONT VIEW

SIDE VIEW

BOTTOM VIEW

DETAIL

B

SCALE 50

DETAIL

A

SCALE 20

F

3

0.203

F

2

C

Package

Substrate

Underfill

Die

N

SEE DETAIL

A

SEE DETAIL

B

479 BALLS

B

A

B

2

B

1

C

2

C

1

H

2

J

1

J

2

G

2

H

1

G

1

B

1

34.95

34.95 35.05

1.937 2.207

0.61 0.69

35.05

SYMBOL

COMMENTS

MILLIMETERS

MIN MAX

B

2

9.4

C

2

8.7

C

1

0.88

F

2

31.75 BASIC

G

2

31.75 BASIC

G

1

15.875 BASIC

H

2

15.875 BASIC

H

1

W

M

6g

N

0.6 0.8

1.27 BASIC

J

2

1.27 BASIC

J

1

F

3

ø0.203

CA

L

B

ø0.071

ø

M

L

1 2 ... 50 51 52 53 54 55 56 57 58 59 60 ... 112 113

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