Intel FV8050366233 Arkusz Danych Pobierz pdf (Strona 51)

E PENTIUM® PROCESSOR WITH MMX™ TECHNOLOGY

51

5/23/97 10:47 AM 24318502.DOC

INTEL CONFIDENTIAL

(until publication date)

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Air Flow Rate [LFM]

Figure 16. Thermal Resistance vs. Heatsink Height, PPGA Packages

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