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Document Number: 318734-015
Intel
®
Core2 Duo Processor
E8000
and E7000
Series, Intel
®
Pentium
®
Dual-Core Processor
E6000
and E5000
Series, and
Intel
®
Celeron
®
Processor E3x00
Series
Thermal and Mechanical Design Guidelines
August 2010
Przeglądanie stron 0
1 2 3 4 5 6 ... 127 128

Podsumowanie treści

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Document Number: 318734-015 Intel® Core™2 Duo Processor E8000∆ and E7000∆ Series, Intel® Pentium® Dual-Core Processor E6000∆ and E5000∆ Series

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10 Thermal and Mechanical Design Guidelines

Strona 3 - Contents

Case Temperature Reference Metrology 100 Thermal and Mechanical Design Guidelines 25. Lift the heater block and magnified lens, using tweezers

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Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 101 Figure 7-31. Thermocouple placed into groove 29. Using a

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Case Temperature Reference Metrology 102 Thermal and Mechanical Design Guidelines 31. Fill the rest of the groove with Loctite* 498 Adhesive.

Strona 6 - Figures

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 103 Figure 7-35. Removing Excess Adhesive from IHS 33. Using

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Case Temperature Reference Metrology 104 Thermal and Mechanical Design Guidelines D.6 Thermocouple Wire Management When installing the proces

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Balanced Technology Extended (BTX) System Thermal Considerations Thermal and Mechanical Design Guidelines 105 Appendix E Balanced Technology E

Strona 9 - Revision History

Balanced Technology Extended (BTX) System Thermal Considerations 106 Thermal and Mechanical Design Guidelines The thermal sensor location and

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Balanced Technology Extended (BTX) System Thermal Considerations Thermal and Mechanical Design Guidelines 107 Figure 7-39. Thermal sensor Loca

Strona 11 - 1 Introduction

Balanced Technology Extended (BTX) System Thermal Considerations 108 Thermal and Mechanical Design Guidelines

Strona 12 - 1.1.3 Document Scope

Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 109 Appendix F Fan Performance for Reference Design The fan powe

Strona 13 - 1.3 Definition of Terms

Introduction Thermal and Mechanical Design Guidelines 11 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management

Strona 14 - Ψ measurements

Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines

Strona 15 - Information

Mechanical Drawings Thermal and Mechanical Design Guidelines 111 Appendix G Mechanical Drawings The following table lists the mechanical drawi

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Mechanical Drawings 112 Thermal and Mechanical Design Guidelines Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Rest

Strona 17 - 2.1.2 Heatsink Attach

Mechanical Drawings Thermal and Mechanical Design Guidelines 113 Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height Re

Strona 18 - 2.2 Thermal Requirements

Mechanical Drawings 114 Thermal and Mechanical Design Guidelines Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height Rest

Strona 19 - 2.2.2 Thermal Profile

Mechanical Drawings Thermal and Mechanical Design Guidelines 115 Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1

Strona 20 - 2.2.4 T

Mechanical Drawings 116 Thermal and Mechanical Design Guidelines Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2

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Mechanical Drawings Thermal and Mechanical Design Guidelines 117 Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3

Strona 22 - 2.3.2 Heatsink Mass

Mechanical Drawings 118 Thermal and Mechanical Design Guidelines Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4

Strona 23 - 2.3.3 Package IHS Flatness

Mechanical Drawings Thermal and Mechanical Design Guidelines 119 Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5

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Introduction 12 Thermal and Mechanical Design Guidelines 1.1.3 Document Scope This design guide supports the following processors: • Intel®

Strona 25 - 2.4.3 Summary

Mechanical Drawings 120 Thermal and Mechanical Design Guidelines Figure 7-48. ATX Reference Clip – Sheet 1 8 7

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Mechanical Drawings Thermal and Mechanical Design Guidelines 121 Figure 7-49. ATX Reference Clip - Sheet 2 HGFEDCBAHGFEDCBA8

Strona 27 - 3 Thermal Metrology

Mechanical Drawings 122 Thermal and Mechanical Design Guidelines Figure 7-50. Reference Fastener - Sheet 1

Strona 28 - 3.1.1 Example

Mechanical Drawings Thermal and Mechanical Design Guidelines 123 Figure 7-51. Reference Fastener - Sheet 2

Strona 29 - Guidelines

Mechanical Drawings 124 Thermal and Mechanical Design Guidelines Figure 7-52. Reference Fastener - Sheet 3

Strona 30 - Thermal Metrology

Mechanical Drawings Thermal and Mechanical Design Guidelines 125 Figure 7-53. Reference Fastener - Sheet 4

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Mechanical Drawings 126 Thermal and Mechanical Design Guidelines Figure 7-54. Intel® E18764-001 Reference Solution Assembly

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Intel® Enabled Reference Solution Information Thermal and Mechanical Design Guidelines 127 Appendix H Intel® Enabled Reference Solution Inform

Strona 33 - Thermal Monitor Feature

Intel® Enabled Reference Solution Information 128 Thermal and Mechanical Design Guidelines Note: These vendors and devices are listed by Inte

Strona 34 - 4.2.1 PROCHOT# Signal

Introduction Thermal and Mechanical Design Guidelines 13 1.2 References Material and concepts available in the following documents may be ben

Strona 35 - 4.2.3 Thermal Monitor 2

Introduction 14 Thermal and Mechanical Design Guidelines Term Description ΨCS Case-to-sink thermal characterization parameter. A measure of t

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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 15 2 Processor Thermal/Mechanical Information 2.1 Mechanic

Strona 37 - 4.2.6 System Considerations

Processor Thermal/Mechanical Information 16 Thermal and Mechanical Design Guidelines The primary function of the IHS is to transfer the non-un

Strona 38 - 4.2.8 THERMTRIP# Signal

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 17 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There

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Processor Thermal/Mechanical Information 18 Thermal and Mechanical Design Guidelines 2.1.2.3 Additional Guidelines In addition to the general

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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 19 Figure 2-2. Processor Case Temperature Measurement Locati

Strona 41 - Design Information

2 Thermal and Mechanical Design Guidelines THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRAN

Strona 42 - 5.1.2 Acoustics

Processor Thermal/Mechanical Information 20 Thermal and Mechanical Design Guidelines The thermal profiles for the Intel Core™2 Duo processor E

Strona 43 - 5.1.3 Effective Fan Curve

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 21 This is achieved in part by using the ΨCA versus RPM and

Strona 44 - Airflow (cfm)

Processor Thermal/Mechanical Information 22 Thermal and Mechanical Design Guidelines required to meet a required performance. As the heatsink

Strona 45 - 5.1.5 Altitude

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 23 The recommended maximum heatsink mass for the ATX thermal

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Processor Thermal/Mechanical Information 24 Thermal and Mechanical Design Guidelines 2.4 System Thermal Solution Considerations 2.4.1 Chassi

Strona 47 - 5.2.2 Power Cycling

Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 25 In addition to passive heatsinks, fan heatsinks and syste

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Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines

Strona 49 - Thermal Module Assembly

Thermal Metrology Thermal and Mechanical Design Guidelines 27 3 Thermal Metrology This section discusses guidelines for testing thermal solut

Strona 50 - Shock Load

Thermal Metrology 28 Thermal and Mechanical Design Guidelines ΨSA is a measure of the thermal characterization parameter from the bottom of th

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Thermal Metrology Thermal and Mechanical Design Guidelines 29 Assume the TDP, as listed in the datasheet, is 100 W and the maximum case temper

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Thermal and Mechanical Design Guidelines 3 Contents 1 Introduction ...

Strona 53 - 6 ATX Thermal/Mechanical

Thermal Metrology 30 Thermal and Mechanical Design Guidelines For active heatsinks, it is important to avoid taking measurement in the dead fl

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Thermal Metrology Thermal and Mechanical Design Guidelines 31 Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsi

Strona 55 - 6.2.1 Heatsink Performance

Thermal Metrology 32 Thermal and Mechanical Design Guidelines 3.4 Processor Case Temperature Measurement Guidelines To ensure functionality a

Strona 56 - 6.2.3 Altitude

Thermal Management Logic and Thermal Monitor Feature Thermal and Mechanical Design Guidelines 33 4 Thermal Management Logic and Thermal Monit

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Thermal Management Logic and Thermal Monitor Feature 34 Thermal and Mechanical Design Guidelines 4.2.1 PROCHOT# Signal The primary function o

Strona 58 - PSD (g^2/Hz)

Thermal Management Logic and Thermal Monitor Feature Thermal and Mechanical Design Guidelines 35 Figure 4-1. Thermal Monitor Control PROCHOT#

Strona 59 - 6.3.2 Power Cycling

Thermal Management Logic and Thermal Monitor Feature 36 Thermal and Mechanical Design Guidelines Once the processor has sufficiently cooled, a

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Thermal Management Logic and Thermal Monitor Feature Thermal and Mechanical Design Guidelines 37 Regardless of the configuration selected, PRO

Strona 61 - Thermal Mechanical Design

Thermal Management Logic and Thermal Monitor Feature 38 Thermal and Mechanical Design Guidelines A system designed to meet the thermal profile

Strona 62 - Less curvature in

Thermal Management Logic and Thermal Monitor Feature Thermal and Mechanical Design Guidelines 39 4.2.10 Digital Thermal Sensor Multiple digit

Strona 63 - Core shoulder

4 Thermal and Mechanical Design Guidelines 4.2.6 System Considerations ... 37 4.2

Strona 64 - Φ38.68 +/- 0.30 mm

Thermal Management Logic and Thermal Monitor Feature 40 Thermal and Mechanical Design Guidelines 4.2.11 Platform Environmental Control Interf

Strona 65 - Technology (Intel

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 41 5 Balanced Technology Ex

Strona 66 - (Output Weighting Matrix)

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 42 Thermal and Mechanical Design Guidelines 5.1.2 Acoustics To optim

Strona 67 - RPM Temperature

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 43 5.1.3 Effective Fan Curv

Strona 68 - Intel® (G)MCH

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 44 Thermal and Mechanical Design Guidelines Figure 5-1. Effective TMA

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 45 5.1.5 Altitude The refer

Strona 70 - 7.3 Intel

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 46 Thermal and Mechanical Design Guidelines Figure 5-2. Random Vibrat

Strona 71 - Loading

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 47 5.2.1.2.1 Recommended Te

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 48 Thermal and Mechanical Design Guidelines 5.2.3 Recommended BIOS/C

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 49 5.4 Safety Requirements

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Thermal and Mechanical Design Guidelines 5 7.3 Intel® QST Configuration and Tuning ...

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 50 Thermal and Mechanical Design Guidelines 5.6 Preload and TMA Stif

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 51 Table 5–4. Processor Prel

Strona 77 - Metrology

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 52 Thermal and Mechanical Design Guidelines mounting hole position fo

Strona 78 - Heatsink Clip Load Metrology

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 53 6 ATX Thermal/Mechanical Design Information 6.1 ATX Re

Strona 79 - Preload Fixture (copper

ATX Thermal/Mechanical Design Information 54 Thermal and Mechanical Design Guidelines Figure 6-1. E18764-001 Reference Design – Exploded View

Strona 80 - B.3 Test Procedure Examples

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 55 6.2 Validation Results for Reference Design 6.2.1 Heat

Strona 81 - Measurement

ATX Thermal/Mechanical Design Information 56 Thermal and Mechanical Design Guidelines 6.2.2 Acoustics To optimize acoustic emission by the fa

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ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 57 6.2.4 Heatsink Thermal Validation Intel recommends eval

Strona 83 - Management

ATX Thermal/Mechanical Design Information 58 Thermal and Mechanical Design Guidelines Figure 6-3. Random Vibration PSD 6.3.1.2 Shock Test Pr

Strona 84 - Thermal Interface Management

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 59 6.3.1.2.1 Recommended Test Sequence Each test sequence

Strona 85 - Reference Metrology

6 Thermal and Mechanical Design Guidelines Figures Figure 2-1. Package IHS Load Areas ...

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ATX Thermal/Mechanical Design Information 60 Thermal and Mechanical Design Guidelines 6.3.3 Recommended BIOS/CPU/Memory Test Procedures This

Strona 87 - D.4 IHS Groove

ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 61 6.5 Safety Requirements Heatsink and attachment assembl

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ATX Thermal/Mechanical Design Information 62 Thermal and Mechanical Design Guidelines 6.7 Reference Attach Mechanism 6.7.1 Structural Design

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ATX Thermal/Mechanical Design Information Thermal and Mechanical Design Guidelines 63 6.7.2 Mechanical Interface to the Reference Attach Mech

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ATX Thermal/Mechanical Design Information 64 Thermal and Mechanical Design Guidelines Figure 6-7. Critical Parameters for Interfacing to Refer

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Intel® Quiet System Technology (Intel® QST) Thermal and Mechanical Design Guidelines 65 7 Intel® Quiet System Technology (Intel® QST) In the

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Intel® Quiet System Technology (Intel® QST) 66 Thermal and Mechanical Design Guidelines Figure 7-1. Intel® QST Overview 7.1.1 Output Weighti

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Intel® Quiet System Technology (Intel® QST) Thermal and Mechanical Design Guidelines 67 temperature to the target temperature. As a result of

Strona 94 - IHS with Groove

Intel® Quiet System Technology (Intel® QST) 68 Thermal and Mechanical Design Guidelines 7.2 Board and System Implementation of Intel® QST To

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Intel® Quiet System Technology (Intel® QST) Thermal and Mechanical Design Guidelines 69 Figure 7-4 shows the major connections for a typical i

Strona 96

Thermal and Mechanical Design Guidelines 7 Figure 7-27. Solder Station Setup ...

Strona 97 - D.5.3 Solder Process

Intel® Quiet System Technology (Intel® QST) 70 Thermal and Mechanical Design Guidelines 7.3 Intel® QST Configuration and Tuning Initial confi

Strona 98

LGA775 Socket Heatsink Loading Thermal and Mechanical Design Guidelines 71 Appendix A LGA775 Socket Heatsink Loading A.1 LGA775 Socket Heatsi

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LGA775 Socket Heatsink Loading 72 Thermal and Mechanical Design Guidelines Simulation shows that the solder joint force (Faxial) is proportion

Strona 100 - Installation

LGA775 Socket Heatsink Loading Thermal and Mechanical Design Guidelines 73 Figure 7-6. Board Deflection Definition d1 d2 d’1 d’2 A.3.2 Boar

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LGA775 Socket Heatsink Loading 74 Thermal and Mechanical Design Guidelines A.3.3 Board Deflection Metric Implementation Example This section

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LGA775 Socket Heatsink Loading Thermal and Mechanical Design Guidelines 75 Figure 7-7. Example—Defining Heatsink Preload Meeting Board Deflect

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LGA775 Socket Heatsink Loading 76 Thermal and Mechanical Design Guidelines A.3.4.1 Motherboard Stiffening Considerations To protect LGA775 so

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Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 77 Appendix B Heatsink Clip Load Metrology B.1 Overview This appendix d

Strona 105 - Thermal Considerations

Heatsink Clip Load Metrology 78 Thermal and Mechanical Design Guidelines Remarks: Alternate Heatsink Sample Preparation As mentioned above, ma

Strona 106

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 79 Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket –

Strona 107 - TMA Airflow

8 Thermal and Mechanical Design Guidelines Tables Table 2–1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions ... 24 T

Strona 108

Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines B.2.2 Typical Test Equipment For the heatsink clip load measurement,

Strona 109 - Reference Design

Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 81 B.3.1 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemb

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Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines

Strona 111

Thermal Interface Management Thermal and Mechanical Design Guidelines 83 Appendix C Thermal Interface Management To optimize a heatsink design

Strona 112 - BOARD PRIMARY SIDE

Thermal Interface Management 84 Thermal and Mechanical Design Guidelines §

Strona 113 - BOARD SECONDARY SIDE

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 85 Appendix D Case Temperature Reference Metrology D.1 Objectiv

Strona 114 - Mechanical Drawings

Case Temperature Reference Metrology 86 Thermal and Mechanical Design Guidelines Item Description Part Number Miscellaneous Hardware Solder

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Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 87 D.3 Thermal Calibration and Controls It is recommended that

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Case Temperature Reference Metrology 88 Thermal and Mechanical Design Guidelines Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at

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Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 89 Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3

Strona 118

Thermal and Mechanical Design Guidelines 9 Revision History Revision Number Description Revision 001 • Initial release. January 2008 002 •

Strona 119

Case Temperature Reference Metrology 90 Thermal and Mechanical Design Guidelines The orientation of the groove at 6 o’clock exit relative to t

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Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 91 D.5 Thermocouple Attach Procedure The procedure to attach a

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Case Temperature Reference Metrology 92 Thermal and Mechanical Design Guidelines 5. Using the microscope and tweezers, bend the tip of the th

Strona 122

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 93 9. Lift the wire at the middle of groove with tweezers and b

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Case Temperature Reference Metrology 94 Thermal and Mechanical Design Guidelines 11. While still at the microscope, press the wire down about

Strona 124

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 95 Figure 7-22. Third Tape Installation 12. Place a 3rd piece o

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Case Temperature Reference Metrology 96 Thermal and Mechanical Design Guidelines 14. Using a fine point device, place a small amount of flux o

Strona 126 - Figure 7-54. Intel

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 97 16. Place the two pieces of solder in parallel, directly over

Strona 127 - Solution Information

Case Temperature Reference Metrology 98 Thermal and Mechanical Design Guidelines Figure 7-27. Solder Station Setup 21. Remove the land side

Strona 128

Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 99 24. You may need to move the solder back toward the groove as

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